A ceramic composite and a method of preparing the same are provided. The method of preparing the ceramic composite includes mixing an aluminum slag and a carbon accelerator to obtain a mixture and reacting the mixture at a temperature equal to or greater than 1600° C. in a nitrogen atmosphere to obtain a ceramic composite. The aluminum slag includes aluminum, oxygen, nitrogen, and magnesium. The weight ratio of the oxygen to the aluminum is 0.6 to 2. The weight ratio of the nitrogen to the aluminum is 0.1 to 1.2. The weight ratio of the magnesium to the aluminum is 0.04 to 0.2. The ceramic composite includes aluminum nitride accounting for at least 90 wt % of the ceramic composite.

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.

Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.

A full-fiber burner brick and a preparation method thereof, comprising mixing alumina crystal fiber and amorphous ceramic fiber with both of them being a combination of fibers of different lengths gradations, and moreover adding fine powder fillers of different particle size gradations and supplementing other additives. This enables the internal structure of the product more uniform, increases the bulk density of the product, and also benefits the suction filterability of fiber cotton blank, and is conducive to forming and improving the strength of the blank. The surface of the brick body is further provided with a coating, which can effectively protect the cotton fiber of the brick body fiber from harsh environments, improve its high temperature resistance, and help to extend the service life of the burner brick.

An alumina-ceramic-based electrical insulator, to a method for producing the insulator, and to a vacuum tube includes the insulator. The electrical insulator is for insulating two electrodes of a vacuum tube through which a charged particle beam flows, the electrical insulator being formed of an alumina-based ceramic. The ceramic comprises a vitreous phase of between 2% and 8% by weight into which at least one metal oxide is diffused from a face of the electrical insulator.

An alumina-ceramic-based electrical insulator, to a method for producing the insulator, and to a vacuum tube includes the insulator. The electrical insulator is for insulating two electrodes of a vacuum tube through which a charged particle beam flows, the electrical insulator being formed of an alumina-based ceramic. The ceramic comprises a vitreous phase of between 2% and 8% by weight into which at least one metal oxide is diffused from a face of the electrical insulator.

A paste for ceramic 3D shaping according to the present invention is a paste for ceramic 3D shaping containing a curable resin and inorganic particles, in which the inorganic particles contain ceramic particles and glass particles.

A paste for ceramic 3D shaping according to the present invention is a paste for ceramic 3D shaping containing a curable resin and inorganic particles, in which the inorganic particles contain ceramic particles and glass particles.

Object

To provide a liquid contact member having high hydrophilicity and exhibiting high dirt removal efficiency by cleaning.

Solution

A liquid contact member includes a ceramic including a plurality of crystal grains and a grain boundary phase, and the concentration of silicon on a liquid contact surface of the ceramic is higher than that of silicon on a virtual internal surface parallel to the liquid contact surface.

Object

To provide a liquid contact member having high hydrophilicity and exhibiting high dirt removal efficiency by cleaning.

Solution

A liquid contact member includes a ceramic including a plurality of crystal grains and a grain boundary phase, and the concentration of silicon on a liquid contact surface of the ceramic is higher than that of silicon on a virtual internal surface parallel to the liquid contact surface.