Patent classifications
C04B35/185
Extraction of digitally printed build material
In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.
Extraction of digitally printed build material
In example implementations, a method for extracting layers of build material into a carrier. The method includes providing a layer of build material onto a bed. Portions of the layer of build material on the bed are digitally printed with a liquid functional material (LFM). The method repeats providing the layer of build material and digitally printing without applying energy to the LFM to define a structure in layers of build material on the bed. The layers of build material are extracted into a carrier and the carrier is removed.
A METHOD OF PRODUCING A CERAMIC SUPPORT AND A CERAMIC SUPPORT
Herein is disclosed a method of producing a ceramic support suitable for a catalyst, the method comprising providing a porous ceramic structure, comprising a body portion with a monomodal macropore structure, wherein the macropores comprises a first mean pore size; washcoating the porous ceramic structure using a suspension comprising oxide and/or hydroxide nanoparticles and drying and calcinating the washcoated porous ceramic structure at a temperature below the melting point of the nanoparticles. In addition, the ceramic support and its structure is disclosed.
A METHOD OF PRODUCING A CERAMIC SUPPORT AND A CERAMIC SUPPORT
Herein is disclosed a method of producing a ceramic support suitable for a catalyst, the method comprising providing a porous ceramic structure, comprising a body portion with a monomodal macropore structure, wherein the macropores comprises a first mean pore size; washcoating the porous ceramic structure using a suspension comprising oxide and/or hydroxide nanoparticles and drying and calcinating the washcoated porous ceramic structure at a temperature below the melting point of the nanoparticles. In addition, the ceramic support and its structure is disclosed.
POROUS ACID-RESISTANT CERAMIC MEDIA
The present disclosure relates to a porous ceramic media that may include a chemical composition, a phase composition, a total open porosity content of at least about 10 vol. % and not greater than about 70 vol. % as a percentage of the total volume of the ceramic media, and a nitric acid resistance parameter of not greater than about 500 ppm. The chemical composition for the porous ceramic media may include SiO.sub.2, Al.sub.2O.sub.3, an alkali component and a secondary metal oxide component selected from the group consisting of an Fe oxide, a Ti oxide, a Ca oxide, a Mg oxide and combinations thereof. The phase composition may include an amorphous silicate, quartz and mullite.
Barrier coating with calcium aluminosilicate additive
A gas turbine engine article includes a substrate and a silicate-resistant barrier coating disposed on the substrate. The silicate-resistant barrier coating is composed of a refractory matrix and a calcium aluminosilicate additive (CAS additive) dispersed in the refractory matrix.
Barrier coating with calcium aluminosilicate additive
A gas turbine engine article includes a substrate and a silicate-resistant barrier coating disposed on the substrate. The silicate-resistant barrier coating is composed of a refractory matrix and a calcium aluminosilicate additive (CAS additive) dispersed in the refractory matrix.
Coating fabrication method for producing engineered microstructure of silicate-resistant barrier coating
A coating fabrication method includes providing engineered granules and thermally consolidating the engineered granules on a substrate to form a silicate-resistant barrier coating. Each of the engineered granules is an aggregate of at least one refractory matrix region and at least one calcium aluminosilicate additive region (CAS additive region) attached with the at least one refractory matrix region. In the thermal consolidation, the refractory matrix region from the engineered granules form grains of a refractory matrix of the silicate-resistant barrier coating and the CAS additive region from the engineered granules form CAS additives that are dispersed in grain boundaries between the grains.
Coating fabrication method for producing engineered microstructure of silicate-resistant barrier coating
A coating fabrication method includes providing engineered granules and thermally consolidating the engineered granules on a substrate to form a silicate-resistant barrier coating. Each of the engineered granules is an aggregate of at least one refractory matrix region and at least one calcium aluminosilicate additive region (CAS additive region) attached with the at least one refractory matrix region. In the thermal consolidation, the refractory matrix region from the engineered granules form grains of a refractory matrix of the silicate-resistant barrier coating and the CAS additive region from the engineered granules form CAS additives that are dispersed in grain boundaries between the grains.
Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate
Provided is a polycrystalline ceramic substrate to be bonded to a compound semiconductor substrate with a bonding layer interposed therebetween, wherein at least one of relational expression (1) 0.7<α.sub.1/α.sub.2<0.9 and relational expression (2) 0.7<α.sub.3/α.sub.4<0.9 holds, where α.sub.1 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 300° C. and α.sub.2 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 300° C., and α.sub.3 represents a linear expansion coefficient of the polycrystalline ceramic substrate at 30° C. to 1000° C. and α.sub.4 represents a linear expansion coefficient of the compound semiconductor substrate at 30° C. to 1000° C.