There is herein described a method of making a single crystal wavelength conversion element from a polycrystalline wavelength conversion element, a single crystal wavelength conversion element, and a light source containing same. By making the single crystal wavelength conversion element from a polycrystalline wavelength conversion element, the method provides greater flexibility in creating single crystal wavelength conversion elements as compared to melt grown methods for forming single crystals. Advantages may include higher activator contents, forming more complex shapes without machining, providing a wider range of possible activator gradients and higher growth rates at lower temperatures.

There is herein described a method of making a single crystal wavelength conversion element from a polycrystalline wavelength conversion element, a single crystal wavelength conversion element, and a light source containing same. By making the single crystal wavelength conversion element from a polycrystalline wavelength conversion element, the method provides greater flexibility in creating single crystal wavelength conversion elements as compared to melt grown methods for forming single crystals. Advantages may include higher activator contents, forming more complex shapes without machining, providing a wider range of possible activator gradients and higher growth rates at lower temperatures.

A binder for an injection moulding composition including: from 40 to 55 volume percent of a polymeric base, from 35 to 45 volume percent of a mixture of waxes or a mixture of wax and palm oil, and at least 5 volume percent of at least one surfactant, wherein the polymeric base is formed of copolymers of ethylene and methacrylic or acrylic acid, copolymers of ethylene and propylene and/or maleic anhydride-grafted polypropylene, and polymers soluble in isopropyl alcohol, propyl alcohol and/or turpentine, and chosen from the group including a cellulose acetate butyrate, a polyvinyl butyral and a copolyamide, the respective quantities of the binder components being such that their sum is equal to 100 volume percent of the binder.

The invention presents a near-infrared photothermal coupling curing non-oxide ceramic slurry, along with its preparation method and application. The ceramic slurry consists of various raw materials, with weight fractions as follows: non-oxide ceramic powder (40?90 parts), photosensitive resin (0.5?20 parts), photosensitive monomer (1?40 parts), photoinitiator (0.25?4 parts), thermal initiator (0.25?4 parts), additive (0.75?5 parts), and up-conversion luminescent material (0.5?4 parts). The non-oxide ceramic powders can include Si.sub.3N.sub.4, TiN, BN, AlN, SiC, WC, TiC, ZrC, TiB.sub.2, and ZrB.sub.2. By combining the photochemical and photothermal dual curing system using near-infrared up-conversion, this invention addresses the issue of insufficient curing encountered in single photocuring or thermal curing processes. Moreover, by incorporating near-infrared light source-driven additive manufacturing, it enables rapid prototyping of high-solid-content non-oxide ceramic slurry, ultimately allowing for the fabrication of high-fidelity non-oxide ceramic structures.

The invention presents a near-infrared photothermal coupling curing non-oxide ceramic slurry, along with its preparation method and application. The ceramic slurry consists of various raw materials, with weight fractions as follows: non-oxide ceramic powder (40?90 parts), photosensitive resin (0.5?20 parts), photosensitive monomer (1?40 parts), photoinitiator (0.25?4 parts), thermal initiator (0.25?4 parts), additive (0.75?5 parts), and up-conversion luminescent material (0.5?4 parts). The non-oxide ceramic powders can include Si.sub.3N.sub.4, TiN, BN, AlN, SiC, WC, TiC, ZrC, TiB.sub.2, and ZrB.sub.2. By combining the photochemical and photothermal dual curing system using near-infrared up-conversion, this invention addresses the issue of insufficient curing encountered in single photocuring or thermal curing processes. Moreover, by incorporating near-infrared light source-driven additive manufacturing, it enables rapid prototyping of high-solid-content non-oxide ceramic slurry, ultimately allowing for the fabrication of high-fidelity non-oxide ceramic structures.

A method for manufacturing active metal-brazed a nitride ceramics substrate having excellent joining strength, includes: a step of preparing a mixed raw material; a step of forming a green sheet of the mixed raw material by a tape casting method; a step of removing a binder by performing degreasing; a step of performing sintering; a step of forming an aluminum nitride sintered substrate by performing gradual cooling; and a step of printing a conductive wiring pattern with active metal paste on the aluminum nitride sintered substrate.

A method for manufacturing active metal-brazed a nitride ceramics substrate having excellent joining strength, includes: a step of preparing a mixed raw material; a step of forming a green sheet of the mixed raw material by a tape casting method; a step of removing a binder by performing degreasing; a step of performing sintering; a step of forming an aluminum nitride sintered substrate by performing gradual cooling; and a step of printing a conductive wiring pattern with active metal paste on the aluminum nitride sintered substrate.

A preparation method of a high-thermal-conductivity and net-size silicon nitride ceramic substrate includes the following steps: (1) mixing an original powder, a sintering aid, a dispersant, a defoamer, a binder, and a plasticizer in a protective atmosphere to allow vacuum degassing to obtain a mixed slurry; (2) subjecting the mixed slurry to tape casting and drying in a nitrogen atmosphere to obtain a first green body; (3) subjecting the first green body to shaping pretreatment to obtain a second green body; (4) subjecting the second green body to debonding at 500? C. to 900? C. to obtain a third green body; and (5) subjecting the third green body to gas pressure sintering in a nitrogen atmosphere at 1,800? C. to 2,000? C. to obtain the high-thermal-conductivity and net-size silicon nitride ceramic substrate.

A preparation method of a high-thermal-conductivity and net-size silicon nitride ceramic substrate includes the following steps: (1) mixing an original powder, a sintering aid, a dispersant, a defoamer, a binder, and a plasticizer in a protective atmosphere to allow vacuum degassing to obtain a mixed slurry; (2) subjecting the mixed slurry to tape casting and drying in a nitrogen atmosphere to obtain a first green body; (3) subjecting the first green body to shaping pretreatment to obtain a second green body; (4) subjecting the second green body to debonding at 500? C. to 900? C. to obtain a third green body; and (5) subjecting the third green body to gas pressure sintering in a nitrogen atmosphere at 1,800? C. to 2,000? C. to obtain the high-thermal-conductivity and net-size silicon nitride ceramic substrate.

The present invention relates to a process for producing a three-dimensional (3D) object by employing a three-dimensional (3D) printing process wherein a granulate having an particle size in the range of 0.2 to 1 mm is used as a starting material to be printed within said 3D printing process, employing a 3D extrusion printer. In one preferred embodiment, the process according to the present invention is employed for producing a 3D greenbody. The invention further relates to 3D objects as such and the corresponding processes for obtaining such 3D objects, in particular a 3D green body, a 3D brown body and a 3D sintered body.