A protective coating system includes a substrate that has an exterior surface exhibiting a degree of valley/hill surface irregularity including a plurality of hills and a plurality of valleys and a first coating layer formed directly on to the exterior surface of the substrate and that conforms to the exterior surface of the substrate such that the first coating layer has a non-uniform coating thickness over the substrate. The protective coating system further includes a second coating layer formed directly on to the exterior surface of the first coating layer. The second coating layer includes a plurality of pores within the second coating layer. Still further, the protective coating system includes a third coating layer formed within at least some of the plurality of pores within the second coating layer.

The present invention relates to a composite material including a porous titania thin film and a preparation method therefor. A composite material according to the present invention allows for a simple thin film formation process because of the use of cellulose crystals, makes it easy to control the structure of the titanium dioxide thin film provided therefor, has a large specific area, and is superior in terms of scratch resistance and photoactivity, thus finding useful applications in the various fields utilizing titanium dioxide as a photocatalyst.

The present invention relates to a composite material including a porous titania thin film and a preparation method therefor. A composite material according to the present invention allows for a simple thin film formation process because of the use of cellulose crystals, makes it easy to control the structure of the titanium dioxide thin film provided therefor, has a large specific area, and is superior in terms of scratch resistance and photoactivity, thus finding useful applications in the various fields utilizing titanium dioxide as a photocatalyst.

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

The present invention describes various methods for manufacturing gel composite sheets using segmented fiber or foam reinforcements and gel precursors. Additionally, rigid panels manufactured from the resulting gel composites are also described. The gel composites are relatively flexible enough to be wound and when unwound, can be stretched flat and made into rigid panels using adhesives.

The plasma-resistant coating film according to the present invention is formed on a substrate, including crystalline Y.sub.2O.sub.3 particles having an average particle diameter of 0.5 μm to 5.0 μm in a SiO.sub.2 film, in which a film density of the plasma-resistant coating film is 90% or more, the film density being obtained by performing image analysis of a cross section of the film with an electron scanning microscope and by using the following expression (1), a size of pores in the film is 5 μm or less in terms of diameter, and a peeling rate of the film from the substrate measured by performing a cross-cut test is 5% or less. Film density (%)=[(S.sub.1−S.sub.2)/S.sub.1]×100 (1). However, in the expression (1), S.sub.1 is an area of the film and S.sub.2 is an area of a pore portion in the film.

The plasma-resistant coating film according to the present invention is formed on a substrate, including crystalline Y.sub.2O.sub.3 particles having an average particle diameter of 0.5 μm to 5.0 μm in a SiO.sub.2 film, in which a film density of the plasma-resistant coating film is 90% or more, the film density being obtained by performing image analysis of a cross section of the film with an electron scanning microscope and by using the following expression (1), a size of pores in the film is 5 μm or less in terms of diameter, and a peeling rate of the film from the substrate measured by performing a cross-cut test is 5% or less. Film density (%)=[(S.sub.1−S.sub.2)/S.sub.1]×100 (1). However, in the expression (1), S.sub.1 is an area of the film and S.sub.2 is an area of a pore portion in the film.