New copper-coated titanium diboride electrodes are disclosed. The copper-coated titanium diboride electrodes may be used in an aluminum electrolysis cell. In one embodiment, a method includes installing the copper-coated titanium diboride electrode in the aluminum electrolysis cell and operating the aluminum electrolysis cell. During start-up, the aluminum electrolysis cell may be preheated and a bath may be formed from a molten electrolyte. Alumina (Al.sub.2O.sub.3) may in the added to the bath and reduced to aluminum metal. At least some of the copper film of the copper-coated titanium diboride electrode may be replaced by an aluminum film, thereby forming an aluminum-wetted titanium diboride electrode.

New copper-coated titanium diboride electrodes are disclosed. The copper-coated titanium diboride electrodes may be used in an aluminum electrolysis cell. In one embodiment, a method includes installing the copper-coated titanium diboride electrode in the aluminum electrolysis cell and operating the aluminum electrolysis cell. During start-up, the aluminum electrolysis cell may be preheated and a bath may be formed from a molten electrolyte. Alumina (Al.sub.2O.sub.3) may in the added to the bath and reduced to aluminum metal. At least some of the copper film of the copper-coated titanium diboride electrode may be replaced by an aluminum film, thereby forming an aluminum-wetted titanium diboride electrode.

A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f.sub.1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f.sub.2, f.sub.2 is less than f.sub.1 by 10 μm or more.

A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f.sub.1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f.sub.2, f.sub.2 is less than f.sub.1 by 10 μm or more.

A fluid heating component including: a pillar-shaped member made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on at least a part of a circumferential surface of the pillar-shaped member, wherein the conductive coating layer is disposed on coats the whole circumference of a cut surface of the pillar-shaped member in a state where the conducive coating layer is electrically connected, in the cut surface of the pillar-shaped member which is perpendicular to a passing direction of the fluid.

A fluid heating component including: a pillar-shaped member made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on at least a part of a circumferential surface of the pillar-shaped member, wherein the conductive coating layer is disposed on coats the whole circumference of a cut surface of the pillar-shaped member in a state where the conducive coating layer is electrically connected, in the cut surface of the pillar-shaped member which is perpendicular to a passing direction of the fluid.

A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.

A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.