Patent classifications
C04B41/4556
METHOD TO PRODUCE A CERAMIC MATRIX COMPOSITE WITH CONTROLLED SURFACE CHARACTERISTICS
A method to produce a ceramic matrix composite with controlled surface characteristics includes: applying a scrim ply to a surface of a fiber preform, where the fiber preform includes silicon carbide fibers coated with boron nitride; infiltrating the fiber preform and the scrim ply with a slurry, thereby forming an impregnated ply on an impregnated fiber preform; infiltrating the impregnated fiber preform and the impregnated ply with a melt comprising silicon, and then cooling, thereby forming a ceramic matrix composite having a ceramic surface layer thereon, where the ceramic surface layer has a predetermined thickness and is devoid of boron; machining or grit blasting the ceramic surface layer to form an intermediate layer suitable for coating; and depositing an environmental barrier coating on the intermediate layer. Thus, a ceramic matrix composite coated with the environmental barrier coating is formed with the intermediate layer in between.
Forming a surface layer of a ceramic matrix composite article
The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.
Forming a surface layer of a ceramic matrix composite article
The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.
INERTIZATION OF MATERIAL SURFACES BY FUNCTIONALIZED PERFLUORINATED MOLECULES
A method for rendering material surfaces inert is provided. Exemplary surfaces include ceramic, metal or plastic surfaces. The method is accomplished with functionalized perfluorinated compounds for the formation of hyperhydrophobic structures on the surfaces to create inert surfaces. The inert surfaces produced or can be produced in this way have an extremely low surface energy, are resistant to deposits of substances or cells and have a very low coefficient of friction. Practical uses of the inert surfaces are also provided.
Oxidation protection systems and methods
A method of forming a B.sub.4C layer as a component of an oxidation protection system as component of oxidation protection system on a carbon-carbon composite material may include forming a liquid mixture comprising a boron-compound and a carbon-compound. The method may further include applying the liquid mixture on the carbon-carbon composite material. The boron compound may comprise boric acid (H.sub.3BO.sub.3). In various embodiments, the carbon-compound comprises phenolic resin. In various embodiments, the method further includes heating the carbon-carbon composite material after applying the liquid mixture on the carbon-carbon composite material to from a boron carbide (B.sub.4C) layer.
Oxidation protection systems and methods
A method of forming a B.sub.4C layer as a component of an oxidation protection system as component of oxidation protection system on a carbon-carbon composite material may include forming a liquid mixture comprising a boron-compound and a carbon-compound. The method may further include applying the liquid mixture on the carbon-carbon composite material. The boron compound may comprise boric acid (H.sub.3BO.sub.3). In various embodiments, the carbon-compound comprises phenolic resin. In various embodiments, the method further includes heating the carbon-carbon composite material after applying the liquid mixture on the carbon-carbon composite material to from a boron carbide (B.sub.4C) layer.
METHOD FOR MANUFACTURING CIRCUIT BOARD INCLUDING METAL-CONTAINING LAYER
Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).
METHOD FOR MANUFACTURING CIRCUIT BOARD INCLUDING METAL-CONTAINING LAYER
Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).
Ceramic heat shields having a reaction coating
A ceramic heat shield for a gas turbine. The ceramic heat shield has a ceramic body containing aluminium oxide and has a surface layer of the ceramic body which contains yttrium aluminium garnet as reaction coating material. A gas turbine includes such a ceramic heat shield and a method produces such a ceramic heat shield.
Ceramic heat shields having a reaction coating
A ceramic heat shield for a gas turbine. The ceramic heat shield has a ceramic body containing aluminium oxide and has a surface layer of the ceramic body which contains yttrium aluminium garnet as reaction coating material. A gas turbine includes such a ceramic heat shield and a method produces such a ceramic heat shield.