A heat-resistant member according to the present invention includes a member to be protected and a metal oxide ceramic protective layer which is disposed on part of or all surfaces of the member to be protected and which has a porosity of 0 percent by volume or more and 5 percent by volume or less. This heat-resistant member is produced through the step of forming a protective layer by firing a member to be protected provided with a metal raw material in the air in a temperature range lower than the melting point of an oxide of the metal raw material to form a metal oxide ceramic protective layer having a porosity of 0 percent by volume or more and 5 percent by volume or less on part of or all surfaces of the member to be protected.

A heat-resistant member according to the present invention includes a member to be protected and a metal oxide ceramic protective layer which is disposed on part of or all surfaces of the member to be protected and which has a porosity of 0 percent by volume or more and 5 percent by volume or less. This heat-resistant member is produced through the step of forming a protective layer by firing a member to be protected provided with a metal raw material in the air in a temperature range lower than the melting point of an oxide of the metal raw material to form a metal oxide ceramic protective layer having a porosity of 0 percent by volume or more and 5 percent by volume or less on part of or all surfaces of the member to be protected.

An Aluminum nitride ceramic and preparation method thereof. The aluminum nitride ceramic comprises a porous aluminum nitride matrix. A ferrite is loaded on the pore surface of the porous aluminum nitride matrix; and nano nickel particles are loaded on the surface of the ferrite. The preparation method of the aluminum nitride ceramic comprises steps: sintering the aluminum nitride ceramic by pressureless sintering method, depositing the ferrite on pore surface of porous aluminum nitride matrix by hydrothermal method, and loading nano nickel particles on the surface of the ferrite by reduction method. A micro-reactor is provided. So that the technical problems: the preheating time of the micro-reactor prepared is too long, nickel particles fall off from the surface of matrix, and nano nickel particles grow up due to quick and direct temperature rise can be solved.

An Aluminum nitride ceramic and preparation method thereof. The aluminum nitride ceramic comprises a porous aluminum nitride matrix. A ferrite is loaded on the pore surface of the porous aluminum nitride matrix; and nano nickel particles are loaded on the surface of the ferrite. The preparation method of the aluminum nitride ceramic comprises steps: sintering the aluminum nitride ceramic by pressureless sintering method, depositing the ferrite on pore surface of porous aluminum nitride matrix by hydrothermal method, and loading nano nickel particles on the surface of the ferrite by reduction method. A micro-reactor is provided. So that the technical problems: the preheating time of the micro-reactor prepared is too long, nickel particles fall off from the surface of matrix, and nano nickel particles grow up due to quick and direct temperature rise can be solved.

A heat-resistant member includes a member that is a target to be protected and a protective layer arranged on the whole or part of a surface of the member. The protective layer includes an oxide ceramic containing an Fe.sub.3O.sub.4 phase in which a solute component capable of forming a spinel-type oxide with Fe is solid-dissolved.

A heat-resistant member includes a member that is a target to be protected and a protective layer arranged on the whole or part of a surface of the member. The protective layer includes an oxide ceramic containing an Fe.sub.3O.sub.4 phase in which a solute component capable of forming a spinel-type oxide with Fe is solid-dissolved.

The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.