There is provided a composition for joining and/or treating ceramic materials. The composition can comprise approximately 15 wt % to approximately 90 wt % ceramic nanoparticles, approximately 0.1 wt % to approximately 8 wt % dispersant, and approximately 2 wt % to approximately 84.9 wt % solvent. There is also provided a method of joining a first ceramic part and a second ceramic part at a joining interface to form a joined ceramic component, and a method of treating a ceramic component at a treatment surface to form a treated ceramic component. There is further provided a joined ceramic component.

There is provided a composition for joining and/or treating ceramic materials. The composition can comprise approximately 15 wt % to approximately 90 wt % ceramic nanoparticles, approximately 0.1 wt % to approximately 8 wt % dispersant, and approximately 2 wt % to approximately 84.9 wt % solvent. There is also provided a method of joining a first ceramic part and a second ceramic part at a joining interface to form a joined ceramic component, and a method of treating a ceramic component at a treatment surface to form a treated ceramic component. There is further provided a joined ceramic component.