Composites of silicon and various porous scaffold materials, such as carbon material comprising micro-, meso- and/or macropores, and methods for manufacturing the same are provided. The compositions find utility in various applications, including electrical energy storage electrodes and devices comprising the same.

Composites of silicon and various porous scaffold materials, such as carbon material comprising micro-, meso- and/or macropores, and methods for manufacturing the same are provided. The compositions find utility in various applications, including electrical energy storage electrodes and devices comprising the same.

An article may include a substrate including a ceramic or a ceramic matrix composite. The substrate defines a hot side surface configured to face a heated gas environment and a cool side surface opposite the hot side surface. The article also includes a cool side coating on the cool side surface. The cool side coating comprises at least one material having a flow temperature equal to or slightly less than a temperature of the heated gas environment.

An article may include a substrate including a ceramic or a ceramic matrix composite. The substrate defines a hot side surface configured to face a heated gas environment and a cool side surface opposite the hot side surface. The article also includes a cool side coating on the cool side surface. The cool side coating comprises at least one material having a flow temperature equal to or slightly less than a temperature of the heated gas environment.

Particulate composite materials and devices comprising the same are provided.

Particulate composite materials and devices comprising the same are provided.

An article includes a substrate, an intermediate coating on the substrate, and an environmental barrier coating (EBC) on the intermediate coating. The substrate includes a ceramic, ceramic matrix composite (CMC), or superalloy. The EBC includes a rare earth disilicate. When the intermediate coating is at an initial state, such as prior to exposure to an oxidating environment, the intermediate coating includes a bond coat on the substrate and a reactive layer on the bond coat. The bond coat includes silicon, while the reactive layer includes a rare earth monosilicate or rare earth oxide. In response to oxidation of a portion of the silicon of the bond coat to form silicon dioxide, a portion of the rare earth monosilicate or rare earth oxide of the reactive layer is configured to react with at least a portion of the silicon dioxide to form a converted layer that includes a rare earth disilicate.

In one example, a method for forming a coating system including a bond coat and an environmental barrier coating on a ceramic or CMC substrate, e.g., with an abradable coating on the environmental barrier coating. The method may include depositing a bond coat on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited bond coat; heat treating the as-deposited bond coat following the deposition of the as-deposited bond coat on the substrate to form a heat treated bond coat; depositing an environment barrier coating (EBC) layer on the heat treated bond coat to form as deposited EBC layer; and heat treating the as-deposited EBC layer to form a heat treated EBC layer.

In one example, a method for forming a coating system including a bond coat and an environmental barrier coating on a ceramic or CMC substrate, e.g., with an abradable coating on the environmental barrier coating. The method may include depositing a bond coat on a ceramic or ceramic matrix composite (CMC) substrate to form an as-deposited bond coat; heat treating the as-deposited bond coat following the deposition of the as-deposited bond coat on the substrate to form a heat treated bond coat; depositing an environment barrier coating (EBC) layer on the heat treated bond coat to form as deposited EBC layer; and heat treating the as-deposited EBC layer to form a heat treated EBC layer.

A honeycomb structure, including: a plurality of pillar shaped honeycomb segments, each of the pillar shaped honeycomb segments including a partition wall and a plugged portion; and a joining layer arranged so as to join side surfaces of the pillar shaped honeycomb segments to each other. The honeycomb structure satisfies the following equations (1) to (3):
y≤1000  (1);
y≤717.92x.sup.−0.095  (2); and
y≥462.4x.sup.−0.153  (3),
in which y is a maximum temperature (° C.) at which the use of the honeycomb structure is accepted, and x is a thermal conduction factor represented by the following equation:
thermal conduction factor=(thermal conductivity of the partition wall×thermal conductivity of the joining layer)/(average thickness of the joining layer×porosity of the partition wall).