Oxalic acid is employed in a precursor mixture containing at least one milled alpha alumina powder having a particle size of 0.1 to 6 microns, boehmite powder that functions as a binder of the alpha alumina powders, and at least one burnout material having a particle size of 1-10 microns to provide a porous body having enhanced pore architecture in which extrusion cracks can be reduced. The presence of oxalic acid in such as precursor mixture can reduce and even eliminate NOx emission during a high temperature heat treatment process.

Oxalic acid is employed in a precursor mixture containing at least one milled alpha alumina powder having a particle size of 0.1 to 6 microns, boehmite powder that functions as a binder of the alpha alumina powders, and at least one burnout material having a particle size of 1-10 microns to provide a porous body having enhanced pore architecture in which extrusion cracks can be reduced. The presence of oxalic acid in such as precursor mixture can reduce and even eliminate NOx emission during a high temperature heat treatment process.

Disclosed herein is a method for applying metals to clay. More particularly, the present invention relates to applying malleable metals, such as silver, to clay, such that the metal attaches to the clay and as an added feature forms beads on the surface of the clay.

Disclosed herein is a method for applying metals to clay. More particularly, the present invention relates to applying malleable metals, such as silver, to clay, such that the metal attaches to the clay and as an added feature forms beads on the surface of the clay.

An apparatus includes a ceramic matrix composite (CMC) component and an interface coating on the CMC component, wherein the interface coating includes a layer of at least one of the following compositions: 40-50 wt % Nb, 28-42 wt % Al, 4-15 wt % Cr, 1-2 wt % Si; 90-92 wt % Mo, 4-5 wt % Si, 4-5 wt % B; or 60-80 wt % V, 20-30 wt % Cr, 2-15 wt % Ti.

An apparatus includes a ceramic matrix composite (CMC) component and an interface coating on the CMC component, wherein the interface coating includes a layer of at least one of the following compositions: 40-50 wt % Nb, 28-42 wt % Al, 4-15 wt % Cr, 1-2 wt % Si; 90-92 wt % Mo, 4-5 wt % Si, 4-5 wt % B; or 60-80 wt % V, 20-30 wt % Cr, 2-15 wt % Ti.

A method of making a ceramic glaze formulation having an antimicrobial property for use with a ceramic article. The method comprises fritting an antimicrobial formulation in a flux frit, providing least one unfritted antimicrobial component, providing a silver carrier in a glass matrix, and combining the flux frit, the at least one unfritted component, and the silver carrier in the glass matrix to form the ceramic glaze formulation. The silver carrier is combined at an addition rate based on a dry weight basis of the ceramic glaze formulation. A ceramic glaze additive formulation and ceramic glazed article are also provided.

A method of making a ceramic glaze formulation having an antimicrobial property for use with a ceramic article. The method comprises fritting an antimicrobial formulation in a flux frit, providing least one unfritted antimicrobial component, providing a silver carrier in a glass matrix, and combining the flux frit, the at least one unfritted component, and the silver carrier in the glass matrix to form the ceramic glaze formulation. The silver carrier is combined at an addition rate based on a dry weight basis of the ceramic glaze formulation. A ceramic glaze additive formulation and ceramic glazed article are also provided.

A conductive paste includes a high melting point metal particle having a melting point exceeding a baking temperature, a molten metal particle containing a metal or an alloy which melts at a temperature equivalent to or lower than the baking temperature and has a melting point of 700 C. or lower, an active metal particle containing an active metal, and an organic vehicle.

A conductive paste includes a high melting point metal particle having a melting point exceeding a baking temperature, a molten metal particle containing a metal or an alloy which melts at a temperature equivalent to or lower than the baking temperature and has a melting point of 700 C. or lower, an active metal particle containing an active metal, and an organic vehicle.