Methods for producing components for use in high temperature systems that include reacting a fluid reactant and a porous preform that has a pore volume and contains a solid oxide reactant that defines a solid volume of the porous preform. The method includes infiltrating the fluid reactant into the porous preform to react with the solid oxide reactant to produce a oxide/metal composite component, during which a displacing metal replaces a displaceable species of the solid oxide reactant to produce at least one solid oxide reaction product that has a reaction product volume that at least partially fills the pore volume. The oxide/metal composite component includes at least one oxide phase and at least one metal phase. The component is exposed to temperatures greater than 500 C. and the at least one oxide phase and the at least one metal phase exhibit thermal expansion values within 50% of one another.

Methods for producing components for use in high temperature systems that include reacting a fluid reactant and a porous preform that has a pore volume and contains a solid oxide reactant that defines a solid volume of the porous preform. The method includes infiltrating the fluid reactant into the porous preform to react with the solid oxide reactant to produce a oxide/metal composite component, during which a displacing metal replaces a displaceable species of the solid oxide reactant to produce at least one solid oxide reaction product that has a reaction product volume that at least partially fills the pore volume. The oxide/metal composite component includes at least one oxide phase and at least one metal phase. The component is exposed to temperatures greater than 500 C. and the at least one oxide phase and the at least one metal phase exhibit thermal expansion values within 50% of one another.

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

The present disclosure relates to the field of ceramics, and discloses a metal-based aluminum nitride composite material. The composite material includes an aluminum nitride ceramic skeleton and a metal filling at least part of pores of the aluminum nitride ceramic skeleton. The aluminum nitride ceramic skeleton contains aluminum nitride and CuAlO.sub.2, and the aluminum nitride ceramic skeleton has a porosity of 20 to 40 percent. The present disclosure further discloses a method for preparing the metal-based aluminum nitride composite material and the metal-based aluminum nitride composite material obtained by the method. A CuAlO.sub.2 substance is formed in the aluminum nitride ceramic skeleton obtained in the present disclosure.

The present disclosure relates to the field of ceramics, and discloses a metal-based aluminum nitride composite material. The composite material includes an aluminum nitride ceramic skeleton and a metal filling at least part of pores of the aluminum nitride ceramic skeleton. The aluminum nitride ceramic skeleton contains aluminum nitride and CuAlO.sub.2, and the aluminum nitride ceramic skeleton has a porosity of 20 to 40 percent. The present disclosure further discloses a method for preparing the metal-based aluminum nitride composite material and the metal-based aluminum nitride composite material obtained by the method. A CuAlO.sub.2 substance is formed in the aluminum nitride ceramic skeleton obtained in the present disclosure.

A fluid heating component including: a pillar-shaped member made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on at least a part of a circumferential surface of the pillar-shaped member, wherein the conductive coating layer is disposed on coats the whole circumference of a cut surface of the pillar-shaped member in a state where the conducive coating layer is electrically connected, in the cut surface of the pillar-shaped member which is perpendicular to a passing direction of the fluid.

A fluid heating component including: a pillar-shaped member made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on at least a part of a circumferential surface of the pillar-shaped member, wherein the conductive coating layer is disposed on coats the whole circumference of a cut surface of the pillar-shaped member in a state where the conducive coating layer is electrically connected, in the cut surface of the pillar-shaped member which is perpendicular to a passing direction of the fluid.

The invention relates to a process for metallizing ferrite ceramics, which comprises the following steps: arrangement of a. contact element composed of copper or a copper alloy on a surface of the ferrite ceramic, melting of the contact element at least in the region in which the contact element contacts the surface of the ferrite ceramic, and cooling of the contact element and the ferrite ceramic to below the melting point of copper or the copper alloy.

The invention relates to a process for metallizing ferrite ceramics, which comprises the following steps: arrangement of a. contact element composed of copper or a copper alloy on a surface of the ferrite ceramic, melting of the contact element at least in the region in which the contact element contacts the surface of the ferrite ceramic, and cooling of the contact element and the ferrite ceramic to below the melting point of copper or the copper alloy.