A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.

A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.

Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600 C. without a significant reduction in thermal and mechanical properties.

Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600 C. without a significant reduction in thermal and mechanical properties.

A conductive paste includes a high melting point metal particle having a melting point exceeding a baking temperature, a molten metal particle containing a metal or an alloy which melts at a temperature equivalent to or lower than the baking temperature and has a melting point of 700 C. or lower, an active metal particle containing an active metal, and an organic vehicle.

A conductive paste includes a high melting point metal particle having a melting point exceeding a baking temperature, a molten metal particle containing a metal or an alloy which melts at a temperature equivalent to or lower than the baking temperature and has a melting point of 700 C. or lower, an active metal particle containing an active metal, and an organic vehicle.

Brake disks with integrated heat sink are provided. Brake disk includes a fiber-reinforced composite material and an encapsulated heat sink material impregnated into the fiber-reinforced composite material. The encapsulated heat sink material comprises a heat sink material encapsulated within a silicon-containing encapsulation layer. Methods for manufacturing the brake disk with integrated heat sink and methods for producing the encapsulated heat sink material are also provided.

Brake disks with integrated heat sink are provided. Brake disk includes a fiber-reinforced composite material and an encapsulated heat sink material impregnated into the fiber-reinforced composite material. The encapsulated heat sink material comprises a heat sink material encapsulated within a silicon-containing encapsulation layer. Methods for manufacturing the brake disk with integrated heat sink and methods for producing the encapsulated heat sink material are also provided.

A biocidal additive package comprises at least one metal or metal containing compound selected from the group consisting of Cu.sub.2O, Cu(OH).sub.2, Cu, CuO.sub.3, Cu.sub.2O.sub.3, and a combination thereof, and at least one non-copper metal or non-copper containing metal compound. Non-limiting examples of non-copper metal and non-copper containing metal compounds are Ag, Ag.sub.2O, Bi, Bi.sub.2O.sub.3, Zn, ZnO, or a combination thereof. A biocidal ceramic glaze layer and an article comprising a biocidal ceramic glaze layer are provided. Also provided is a method of affixing a biocidal ceramic glaze to a substrate.

A biocidal additive package comprises at least one metal or metal containing compound selected from the group consisting of Cu.sub.2O, Cu(OH).sub.2, Cu, CuO.sub.3, Cu.sub.2O.sub.3, and a combination thereof, and at least one non-copper metal or non-copper containing metal compound. Non-limiting examples of non-copper metal and non-copper containing metal compounds are Ag, Ag.sub.2O, Bi, Bi.sub.2O.sub.3, Zn, ZnO, or a combination thereof. A biocidal ceramic glaze layer and an article comprising a biocidal ceramic glaze layer are provided. Also provided is a method of affixing a biocidal ceramic glaze to a substrate.