The present application discloses a method for fabricating a ceramic heating body with a porous heating film, which relates to technical field of fabricating method of heating body; the method including mixing, ball-milling, defoaming, molding and drying, sintering, paraffin filling, machining, coating, metalizing sintering, and electrode leading; the beneficial effects of the present application is simple in whole fabricating method, and by using a box furnace to sinter the green body under an oxidizing atmosphere and normal pressure, the fabricated ceramic heating body is heated uniformly and the heating efficiency is high.

The present application discloses a method for fabricating a ceramic heating body with a porous heating film, which relates to technical field of fabricating method of heating body; the method including mixing, ball-milling, defoaming, molding and drying, sintering, paraffin filling, machining, coating, metalizing sintering, and electrode leading; the beneficial effects of the present application is simple in whole fabricating method, and by using a box furnace to sinter the green body under an oxidizing atmosphere and normal pressure, the fabricated ceramic heating body is heated uniformly and the heating efficiency is high.

An antiballistic armor-plating component, includes a ceramic body made of a material comprising, as percentages by volume, between 35% and 55% of silicon carbide, between 20% and 50% of boron carbide, between 15% and 35% of a metallic silicon phase or of a metallic phase including silicon.

The disclosure relates to sintered ceramic grains comprising 3-55 wt. % alumina, 40-95 wt. % zirconia and 1-30 wt. % of one or more other inorganic components. The invention further relates to a method for preparing ceramic grains according to the invention, comprising: making a slurry comprising alumina, zirconia; making droplets of the slurry; introducing the droplets in a liquid gelling-reaction medium wherein the droplets are gellified; drying the gellified deformed droplets.

The disclosure relates to sintered ceramic grains comprising 3-55 wt. % alumina, 40-95 wt. % zirconia and 1-30 wt. % of one or more other inorganic components. The invention further relates to a method for preparing ceramic grains according to the invention, comprising: making a slurry comprising alumina, zirconia; making droplets of the slurry; introducing the droplets in a liquid gelling-reaction medium wherein the droplets are gellified; drying the gellified deformed droplets.

Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

A method for coating a substrate includes spraying a combination of powders. The combination of powders includes: Hf.sub.0.5Si.sub.0.5O.sub.2; Zr.sub.0.5Si.sub.0.5O.sub.2; and, optionally, at least one of HfO.sub.2 and ZrO.sub.2. A molar ratio of said Hf.sub.0.5Si.sub.0.5O.sub.2 and HfO.sub.2 combined to said Zr.sub.0.5Si.sub.0.5O.sub.2 and ZrO.sub.2 combined is from 2:1 to 4:1. A molar ratio of said Hf.sub.0.5Si.sub.0.5O.sub.2 to said HfO.sub.2 is at least 1:3.

Thin films of precious metals such as platinum and gold have the required ability to withstand high temperatures, but in pure form can suffer from grain growth, agglomeration and dewetting at high temperature. Grain boundaries must therefore be pinned by alloying with other metals and/or by inclusion of non-metallic nanoparticles. While such bulk materials are known in the prior art, they have not existed previously as printable inks that can be deposited by additive manufacturing direct-write methods. These materials have been formulated for the first time as alloy and composite inks so that they may be applied by direct-write additive manufacturing techniques directly onto three-dimensional components or on high temperature substrates that can be adhered to complex components.

Thin films of precious metals such as platinum and gold have the required ability to withstand high temperatures, but in pure form can suffer from grain growth, agglomeration and dewetting at high temperature. Grain boundaries must therefore be pinned by alloying with other metals and/or by inclusion of non-metallic nanoparticles. While such bulk materials are known in the prior art, they have not existed previously as printable inks that can be deposited by additive manufacturing direct-write methods. These materials have been formulated for the first time as alloy and composite inks so that they may be applied by direct-write additive manufacturing techniques directly onto three-dimensional components or on high temperature substrates that can be adhered to complex components.

A method comprises discharging from a metal vaporization device a vapor of a metal or a metal precursor to a chemical vapor infiltration device where the chemical vapor infiltration device is in fluid communication with the metal vaporization device. The chemical vapor infiltration device contains a preform containing ceramic fibers. The preform is infiltrated with a metallic coating or a coating of a metallic precursor along with a ceramic precursor coating. The metallic coating and/or the metallic precursor coating and the ceramic precursor coating are applied sequentially or simultaneously.