Patent classifications
C04B41/5144
Electroconductive paste, electronic substrate, and method for manufacturing said substrate
An electroconductive paste comprises high melting point metal particles having a melting point that exceeds the firing temperature; molten metal particles containing a metal or an alloy that melts at the firing temperature, for which the melting point is 700 C. or less; active metal particles containing an active metal; and an organic vehicle.
METHODS OF MANUFACTURING OXIDE/METAL COMPOSITE COMPONENTS AND THE COMPONENTS PRODUCED THEREFROM
Methods for producing components for use in high temperature systems that include reacting a fluid reactant and a porous preform that has a pore volume and contains a solid oxide reactant that defines a solid volume of the porous preform. The method includes infiltrating the fluid reactant into the porous preform to react with the solid oxide reactant to produce a oxide/metal composite component, during which a displacing metal replaces a displaceable species of the solid oxide reactant to produce at least one solid oxide reaction product that has a reaction product volume that at least partially fills the pore volume. The oxide/metal composite component includes at least one oxide phase and at least one metal phase. The component is exposed to temperatures greater than 500 C. and the at least one oxide phase and the at least one metal phase exhibit thermal expansion values within 50% of one another.
METHODS OF MANUFACTURING OXIDE/METAL COMPOSITE COMPONENTS AND THE COMPONENTS PRODUCED THEREFROM
Methods for producing components for use in high temperature systems that include reacting a fluid reactant and a porous preform that has a pore volume and contains a solid oxide reactant that defines a solid volume of the porous preform. The method includes infiltrating the fluid reactant into the porous preform to react with the solid oxide reactant to produce a oxide/metal composite component, during which a displacing metal replaces a displaceable species of the solid oxide reactant to produce at least one solid oxide reaction product that has a reaction product volume that at least partially fills the pore volume. The oxide/metal composite component includes at least one oxide phase and at least one metal phase. The component is exposed to temperatures greater than 500 C. and the at least one oxide phase and the at least one metal phase exhibit thermal expansion values within 50% of one another.
Calcium-magnesium aluminosilicate (CMAS) resistant thermal and environmental barrier coatings
A barrier coating system may include a super alloy or ceramic matrix composite (CMC) substrate underneath a bond coat. The barrier coating system may also include a calcium-magnesium aluminosilicate (CMAS) resistant coating configured to protect metallic, or oxide-based or silicon based components in a harsh CMAS environment.
FLUID HEATING COMPONENT, AND FLUID HEATING COMPONENT COMPLEX
A fluid heating component including: a pillar-shaped member made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on at least a part of a circumferential surface of the pillar-shaped member, wherein the conductive coating layer is disposed on coats the whole circumference of a cut surface of the pillar-shaped member in a state where the conducive coating layer is electrically connected, in the cut surface of the pillar-shaped member which is perpendicular to a passing direction of the fluid.
FLUID HEATING COMPONENT, AND FLUID HEATING COMPONENT COMPLEX
A fluid heating component including: a pillar-shaped member made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on at least a part of a circumferential surface of the pillar-shaped member, wherein the conductive coating layer is disposed on coats the whole circumference of a cut surface of the pillar-shaped member in a state where the conducive coating layer is electrically connected, in the cut surface of the pillar-shaped member which is perpendicular to a passing direction of the fluid.
Capacitor
The dielectric layers are formed from a dielectric porcelain formed from crystal particles containing barium titanate as a main component and containing a rare earth element, and the crystal particles have, in a particle boundary vicinity, a low concentration region in which the concentration of the rare earth element is lower than the concentration of the rare earth element in an inside. The crystal particles further contain vanadium, and the low concentration region contains a larger amount of the vanadium than the amount of the vanadium in the inside. The crystal particles further contain magnesium and manganese, and the magnesium and the manganese have a concentration gradient that is at a maximum at the particle boundary vicinity and that lowers toward the inside.
Compliant layer for ceramic components and methods of forming the same
An apparatus includes a ceramic matrix composite (CMC) component and an interface coating on the CMC component, wherein the interface coating includes a layer of at least one of the following compositions: 40-50 wt % Nb, 28-42 wt % Al, 4-15 wt % Cr, 1-2 wt % Si; 90-92 wt % Mo, 4-5 wt % Si, 4-5 wt % B; or 60-80 wt % V, 20-30 wt % Cr, 2-15 wt % Ti.
Compliant layer for ceramic components and methods of forming the same
An apparatus includes a ceramic matrix composite (CMC) component and an interface coating on the CMC component, wherein the interface coating includes a layer of at least one of the following compositions: 40-50 wt % Nb, 28-42 wt % Al, 4-15 wt % Cr, 1-2 wt % Si; 90-92 wt % Mo, 4-5 wt % Si, 4-5 wt % B; or 60-80 wt % V, 20-30 wt % Cr, 2-15 wt % Ti.
CERAMIC DEVICE AND MANUFACTURING METHOD THEREOF
A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.