An air-heating type heat not burn heating device, a ceramic heating element and a preparation method thereof are provided. The ceramic heating element includes a honeycomb ceramic body and a heating printed circuit. Porous channels are arranged in the honeycomb ceramic body, and the porous channels are circular holes or polygonal holes. The heating printed circuit is arranged around an outer surface of the honeycomb ceramic body to heat the air passing through the porous channels. According to the ceramic heating element, the surface made of high purity alumina honeycomb ceramic has high compactness, it is able to effectively prevent absorption of smoke dust particles, thus to effectively preventing odd smell; the high-purity alumina honeycomb ceramic has good thermal conductivity, with a thermal conductivity of 33 W/mk; the wall thickness and pore diameter in the honeycomb ceramic structure are both very small, and the thermal conductivity is extremely excellent.

Methods of forming structures including a substrate (e.g., ceramic) and an interface layer comprising a metal are disclosed. Structures and electrochemical cells and batteries are also disclosed. Exemplary methods include flash sintering of metal and ceramic materials. Various structures may be suitable for use as solid electrolytes in solid-state electrochemical cells, as well as for many other applications.

A piston for an internal combustion engine and method of construction thereof are provided. The piston includes an upper crown formed at least in part by a first metal material and a thermally insulating insert. The upper crown has an upper wall forming an upper combustion surface and a ring belt region. The upper combustion surface is formed at least in part by the thermally insulating insert. The thermally insulating insert has a base surface with pores extending upwardly therein. The first metal material is infused and solidified in the pores, with the first metal material forming a first bonding surface. The piston further includes a body portion formed from a second metal material. The body portion provides pin bosses having coaxially aligned pin bores and diametrically opposite skirt portions. The body portion has a second bonding surface bonded to the first bonding surface of the first metal material.

A porous body is provided with enhanced fluid transport properties that is capable of performing or facilitating separations, or performing reactions and/or providing areas for such separations or reactions to take place. The porous body includes at least 80 percent alpha alumina and has a pore volume from 0.3 mL/g to 1.2 mL/g and a surface area from 0.3 m.sup.2/g to 3.0 m.sup.2/g. The porous body further includes a pore architecture that provides at least one of a tortuosity of 7.0 or less, a constriction of 4.0 or less and a permeability of 30 mdarcys or greater. The porous body can be used in a wide variety of applications such as, for example, as a filter, as a membrane or as a catalyst carrier.

A porous body is provided with enhanced fluid transport properties that is capable of performing or facilitating separations, or performing reactions and/or providing areas for such separations or reactions to take place. The porous body includes at least 80 percent alpha alumina and has a pore volume from 0.3 mL/g to 1.2 mL/g and a surface area from 0.3 m.sup.2/g to 3.0 m.sup.2/g. The porous body further includes a pore architecture that provides at least one of a tortuosity of 7.0 or less, a constriction of 4.0 or less and a permeability of 30 mdarcys or greater. The porous body can be used in a wide variety of applications such as, for example, as a filter, as a membrane or as a catalyst carrier.

A method of preparing a substrate having a wetting surface, including confirming the presence of an open, interconnected pore network in a ceramic substrate to be wetted with a first metal, filling the open, interconnected pore network with a second metal,

exuding the second metal to coat the surface of the substrate, and wetting the substrate with the first metal. The ceramic substrate is not decomposed by the first metal and the ceramic substrate is not decomposed by the second metal.

A method of preparing a substrate having a wetting surface, including confirming the presence of an open, interconnected pore network in a ceramic substrate to be wetted with a first metal, filling the open, interconnected pore network with a second metal,

exuding the second metal to coat the surface of the substrate, and wetting the substrate with the first metal. The ceramic substrate is not decomposed by the first metal and the ceramic substrate is not decomposed by the second metal.

The subject of the present invention relates to a device that can be applied to the surface of a ceramic matrix composites (CMC) in such a way that the CMC itself will contribute to the extraordinarily large thermoelectric power. The present invention obtains greater resolution of temperature measurements, which can be obtained at exceedingly high temperatures.

There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.

There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.