Disclosed are coatings made of inorganic materials on molds for glass molding, particularly, a graded coating of element diffusion inhibition and adhesion resistance on molds for glass molding. The graded coating includes a Cr adhesion layer which is bonded with a substrate, a CrN intermediate layer and a Cr.sub.xW.sub.yN.sub.(1-x-y) surface layer, where 0.15<x<0.4, and 0.2≤y<0.45. The graded coating has excellent crack growth suppression and adhesion resistance.

Disclosed are coatings made of inorganic materials on molds for glass molding, particularly, a graded coating of element diffusion inhibition and adhesion resistance on molds for glass molding. The graded coating includes a Cr adhesion layer which is bonded with a substrate, a CrN intermediate layer and a Cr.sub.xW.sub.yN.sub.(1-x-y) surface layer, where 0.15<x<0.4, and 0.2≤y<0.45. The graded coating has excellent crack growth suppression and adhesion resistance.

The invention relates to a method for manufacturing a composite component of a timepiece or of a jewelry part, the composite component comprising a porous ceramic part and a metallic material filling the pores of said ceramic part, said method comprising the steps of: providing a porous ceramic preform of the component, providing a metallic material, heating the metallic material to a temperature higher than the melting point of the metallic material, filling the pores of the ceramic preform with the molten metallic material, cooling the metallic material and the ceramic preform to obtain a solidified metallic material in the pores of the ceramic preform, and applying finishing treatments to obtain the composite component,

wherein said porous ceramic preform consists essentially of a material selected from the group consisting of Si.sub.3N.sub.4, SiO.sub.2 and mixtures thereof, and said metallic material is selected from the group consisting of gold, platinum, palladium metals and alloys of these metals.

The invention relates also to a composite component of a timepiece or of a jewelry part comprising a porous ceramic part and a metallic material filling the pores of said ceramic part, wherein said porous ceramic part consists essentially of a material selected from the group consisting of Si.sub.3N.sub.4, SO.sub.2 and mixtures thereof, and said metallic material which is selected from the group consisting of gold, platinum, palladium metals and alloys of these metals.

The invention relates to a method for manufacturing a composite component of a timepiece or of a jewelry part, the composite component comprising a porous ceramic part and a metallic material filling the pores of said ceramic part, said method comprising the steps of: providing a porous ceramic preform of the component, providing a metallic material, heating the metallic material to a temperature higher than the melting point of the metallic material, filling the pores of the ceramic preform with the molten metallic material, cooling the metallic material and the ceramic preform to obtain a solidified metallic material in the pores of the ceramic preform, and applying finishing treatments to obtain the composite component,

wherein said porous ceramic preform consists essentially of a material selected from the group consisting of Si.sub.3N.sub.4, SiO.sub.2 and mixtures thereof, and said metallic material is selected from the group consisting of gold, platinum, palladium metals and alloys of these metals.

The invention relates also to a composite component of a timepiece or of a jewelry part comprising a porous ceramic part and a metallic material filling the pores of said ceramic part, wherein said porous ceramic part consists essentially of a material selected from the group consisting of Si.sub.3N.sub.4, SO.sub.2 and mixtures thereof, and said metallic material which is selected from the group consisting of gold, platinum, palladium metals and alloys of these metals.

An insert includes a cBN sintered compact including cBN particles and a binder phase binding the cBN particles. The cBN particles occupy 60% or more of the cross-sectional area of the cBN sintered compact. The binder phase contains Al compound particles containing at least one of AN or Al.sub.2O.sub.3. A particle distribution of the Al compound particles in a cumulative distribution based on the number of the Al compound particles in a cross section of the cBN sintered compact is as follows. The proportion of the Al compound particles with the particle diameter of 0.3 μm or larger is 5% or more, and the proportion of the Al compound particles with the particle diameter of 0.5 μm or larger is less than 5%.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

A phosphor thermometry device includes a laser that generates a laser pulse onto a thermal barrier coating (TBC) applied onto a substrate. A metallic bond coat layer is on the substrate. A ceramic top coat layer is on the bond coat layer and includes an undoped layer and a doped sensing layer having co-doped first and second rare-earth luminescent dopants that emit respective first and second different emission wavelengths upon excitation by the laser pulse. A detector receives reflected, convoluted luminescence signals from the TBC. First and second photomultiplier devices detect respective first and second different emission wavelengths of the convoluted luminescence signals. A controller receives and processes signals generated from respective first and second photomultiplier devices and determines luminescence lifetime decay and intensity variations for each of the respective first and second rare-earth luminescent dopants for temperature monitoring of the TBC.

A phosphor thermometry device includes a laser that generates a laser pulse onto a thermal barrier coating (TBC) applied onto a substrate. A metallic bond coat layer is on the substrate. A ceramic top coat layer is on the bond coat layer and includes an undoped layer and a doped sensing layer having co-doped first and second rare-earth luminescent dopants that emit respective first and second different emission wavelengths upon excitation by the laser pulse. A detector receives reflected, convoluted luminescence signals from the TBC. First and second photomultiplier devices detect respective first and second different emission wavelengths of the convoluted luminescence signals. A controller receives and processes signals generated from respective first and second photomultiplier devices and determines luminescence lifetime decay and intensity variations for each of the respective first and second rare-earth luminescent dopants for temperature monitoring of the TBC.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

A ceramics substrate includes: a substrate body; and an electric conductor patient that is provided in the substrate body. The substrate body is made of ceramics containing aluminum oxide. The electric conductor pattern is a sintered body that contains tungsten as a main component and further contains nickel oxide, aluminum oxide and silicon dioxide.