A ceramics substrate includes: a substrate body; and an electric conductor patient that is provided in the substrate body. The substrate body is made of ceramics containing aluminum oxide. The electric conductor pattern is a sintered body that contains tungsten as a main component and further contains nickel oxide, aluminum oxide and silicon dioxide.

A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f.sub.1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f.sub.2, f.sub.2 is less than f.sub.1 by 10 μm or more.

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point: a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein hearing is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

A method of applying a top coat to an article according to an exemplary embodiment of this disclosure, among other possible things includes providing an article having a bond coat; applying a slurry directly onto the bond coat, the slurry including particles of a top coat material and at least one sintering aid in a carrier fluid; and sintering the top coat. A slurry composition for applying a top coat to an article is also disclosed.

A method of applying a top coat to an article according to an exemplary embodiment of this disclosure, among other possible things includes providing an article having a bond coat; applying a slurry directly onto the bond coat, the slurry including particles of a top coat material and at least one sintering aid in a carrier fluid; and sintering the top coat. A slurry composition for applying a top coat to an article is also disclosed.

According to one or more embodiments of the present invention, a mirrored apparatus includes a substrate with a non-metal inorganic material that is non-diamond turnable. The mirrored apparatus further includes a finish layer arranged on the surface of the substrate. The finish layer has a polished surface opposite the substrate. The mirrored apparatus also includes a reflective layer arranged on the polished surface of the finish layer.

Aspects of the disclosure provide methods of making a coated filtration material. Various methods include providing a base filter material and applying a first coating to the base filter material, the first coating being in nanoparticle form. A second coating is applied on top of the first coating, the second coating being a nanoscale inorganic material. The method further includes removing the first coating in such a way that the second coating remains on the base filter material. Methods of the disclosure can be used to manufacture coated filtration materials having a coating with a porosity of 90% or greater and a pore size in the range of 0.1-0.5 μm.

The present invention relates to a metalized ceramic substrate and a method for manufacturing the same. The method for manufacturing a metalized ceramic substrate of the present invention comprises the steps of: mixing copper powder and metal oxide to manufacture a copper paste; applying the copper paste to an upper surface of a ceramic substrate; and sintering the copper paste to form a copper metallization layer on the upper surface of the ceramic substrate. According to the present invention, it is possible to form, on the ceramic substrate, a thin copper metallization layer with high density, high bonding strength and low impurities.

An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.

A ceramic membrane filter includes a porous substrate including cells through which a fluid flows, an intermediate membrane formed on the porous substrate, and a separation membrane formed on the intermediate membrane. In this ceramic membrane filter, the percentage of the number of cells having cracks with a size of 4 μm or less relative to the total number of cells is 9% or less.