C04B2235/405

COMPOSITE SINTERED BODY FOR CUTTING TOOL AND CUTTING TOOL USING THE SAME
20170267588 · 2017-09-21 · ·

Disclosed are a composite sintered body for a cutting tool and a cutting tool using the same. The composite sintered body for a cutting tool has enhanced heat conductivity and electrical conductivity to be strong against abrasion by heat and impact and to be capable of minimizing an influence on an edge during an Electrical Discharge Machine (EDM) operation.

Polycrystalline diamond compacts
09808910 · 2017-11-07 · ·

Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate and a preformed polycrystalline diamond table including an interfacial surface bonded to the substrate and an opposing working surface. The preformed polycrystalline diamond table includes a proximal region extending from the interfacial surface to an intermediate location within the preformed polycrystalline diamond table that includes a metallic infiltrant infiltrated from the substrate, and a distal region extending from the working surface to the intermediate location that is substantially free of the metallic infiltrant. A boundary exists between the proximal and distal regions that has a nonplanar irregular profile characteristic of the metallic infiltrant having been infiltrated into the preformed polycrystalline diamond table.

Electrically conductive thin films

An electrically conductive thin film including a compound represented by Chemical Formula 1 and having a layered crystal structure:
A.sub.xM.sub.yCh.sub.z  Chemical Formula 1 wherein A is V, Nb, or Ta, M is Ni, Co, Fe, Pd, Pt, Ir, Rh, Si, or Ge, Ch is S, Se, or Te, x is a number from 1 to 3, y is a number from 1 to 3, and z is a number from 2 to 14.

Density enhancement methods and compositions

The present invention relates to granular composite density enhancement, and related methods and compositions. The application where the properties are valuable include but are not limited to: 1) additive manufacturing (“3D printing”) involving metallic, ceramic, cermet, polymer, plastic, or other dry or solvent-suspended powders or gels, 2) concrete materials, 3) solid propellant materials, 4) cermet materials, 5) granular armors, 6) glass-metal and glass-plastic mixtures, and 7) ceramics comprising (or manufactured using) granular composites.

Cubic boron nitride sintered material, cutting tool including cubic boron nitride sintered material, and method of producing cubic boron nitride sintered material

A cubic boron nitride sintered material includes: more than or equal to 85 volume % and less than 100 volume % of cubic boron nitride grains; and a remainder of a binder, wherein the binder includes WC, Co and an Al compound, and when a TEM-EDX is used to analyze an interface region including an interface at which the cubic boron nitride grains are adjacent to each other, oxygen exists on a whole or part of the interface, and a width D of a region in which the oxygen exists is more than or equal to 0.1 nm and less than or equal to 10 nm.

Cubic boron nitride sintered body and cutting tool including the same

Provided is a cubic boron nitride sintered body including more than or equal to 85 volume percent and less than 100 volume percent of cubic boron nitride particles, and a remainder of a binder, wherein the binder contains WC, Co, and an Al compound, the binder contains W.sub.2Co.sub.21B.sub.6, and, when I.sub.A represents an X-ray diffraction intensity of a (111) plane of the cubic boron nitride particles, I.sub.B represents an X-ray diffraction intensity of a (100) plane of the WC, and I.sub.C represents an X-ray diffraction intensity of a (420) plane of the W.sub.2Co.sub.21B.sub.6, a ratio I.sub.C/I.sub.A of the I.sub.C to the I.sub.A is more than 0 and less than 0.10, and a ratio I.sub.C/I.sub.B of the I.sub.C to the I.sub.B is more than 0 and less than 0.40.

CONDUCTIVE CERAMIC HONEYCOMBS WITH RESISTIVE HEATING CAPABILITY AND METHODS OF MAKING THE SAME

electrically conductive honeycomb body that includes a porous honeycomb structure including a plurality of intersecting porous walls arranged to provide a matrix of cells, the porous walls including wall surfaces that define a plurality of channels extending from an inlet end to an outlet end of the structure. The porous walls include ceramic composite material that includes at least one carbide phase and at least one silicide phase, each carbide and silicide phase including one or more metals selected from the group consisting of Si, Mo, Ti, Zr and W.

SINTERED BALLS MADE OF TUNGSTEN CARBIDE

A sintered ball having: a chemical composition such that, in percentages by mass based on the mass of the ball: 89%≤W≤97%; 5%≤C≤8%; Co≤0.5%; Ni≤0.5%; Elements other than W, C, Co, and Ni, or “Other elements”: ≤3%; a tungsten carbide(s) content greater than 55% in percentage by mass based on the crystallized phases; a bulk density greater than or equal to 14 g/cm.sup.3.

POROUS CERAMIC, MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS, SHOWER PLATE AND PLUG
20210380487 · 2021-12-09 ·

A porous ceramic of the present disclosure contains yttrium zirconate and yttrium oxide, and at least one of them is a main component. A member for a semiconductor manufacturing apparatus such as a shower plate, a plug or the like in a semiconductor manufacturing apparatus is made of the above porous ceramic.

Ceramic material and wire bonding capillary
20220204409 · 2022-06-30 ·

A ceramic material includes zirconia toughened alumina (ZTA), which is doped with zinc ions and other metal ions, in which the other metal ions are chromium (Cr) ions, titanium (Ti) ions, gadolinium (Gd) ions, manganese (Mn) ions, cobalt (Co) ions, iron (Fe) ions, or a combination thereof. The ceramic material may have a hardness of 1600 Hv10 to 2200 Hv10 and a bending strength of 600 MPa to 645 MPa. The ceramic material can be used as wire bonding capillary.