A ceramic joined body includes a first aluminum oxide-based sintered body, a second aluminum oxide-based sintered body, an aluminum oxide-based joint layer located between the first aluminum oxide-based sintered body and the second aluminum oxide-based sintered body, and an aluminum oxide-based protrusion connected to the aluminum oxide-based joint layer, where the average diameter for closed pores of the aluminum oxide-based projection is 0.8 times or more and 1.5 times or less as large as the average diameter for closed pores for each of the first aluminum oxide-based sintered body and the second aluminum oxide-based sintered body.

A process for manufacturing a composite material part includes formation of a fibrous texture from refractory ceramic fibres, placement of the fibrous texture in a mould with interposition of a filtration layer between the fibrous texture and a discharge port, the filtration layer including a partially densified fibrous structure, pressure injection of a slurry containing a powder of refractory ceramic particles into the fibrous texture, drainage by the filtration layer of the slurry solvent having passed through the fibrous texture and retention of the powder of refractory ceramic particles within the texture by the filtration layer to obtain a fibrous preform including the fibrous texture filled with refractory ceramic particles and the filtration layer, heat treatment of the refractory ceramic particles present in the fibrous texture of the preform to form a composite material part including the fibrous texture densified by a refractory ceramic matrix and the filtration layer.

A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 m.

A honeycomb structure including a plurality of porous honeycomb block bodies bound via joining material layers A. Each of the porous honeycomb block bodies includes a plurality of porous honeycomb segments bound via joining material layers B, each of the porous honeycomb segment includes: partition walls that defines a plurality of cells to form flow paths for a fluid, each of cells extending from an inflow end face that is an end face on a fluid inflow side to an outflow end face that is an end face on a fluid outflow side; and an outer peripheral wall located at the outermost periphery. At least a part of the joining material layers A has higher toughness than that of the joining material layers B.

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

A member for a semiconductor manufacturing apparatus includes a ceramic plate having an upper surface serving as a wafer mounting surface and incorporating an electrode, a ceramic dense plug disposed adjacent to a lower surface side of the ceramic plate and ceramic-bonded to the ceramic plate by a ring-shaped joint portion, a metal cooling plate joined to the lower surface of the ceramic plate in a portion other than the ring-shaped joint portion, and a gas flow channel. The gas flow channel includes a gas discharge hole that passes completely through the ceramic plate in the thickness direction of the ceramic plate and an internal gas flow channel that passes from the upper surface to the lower surface of the dense plug while winding through the dense plug. The gas flow channel passes inside of an inner periphery of the joint portion.

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

A refractory article can include a socket including a cavity that is configured to receive a post, a particulate material, and a binder. The binder is configured to bond the post to the socket. The refractory article can include a sleeve coupled to the socket and configured to bond the post to the socket. In an embodiment, the sleeve can bond to the binder. In another embodiment, a collar can be placed between the sleeve and the binder. The collar can be configured to bond the post to the socket. A method of forming a refractory article can include disposing a particulate material within a cavity of a socket and placing a binder material overlying the particulate material.

There is provided a first substrate having a first main surface, a second substrate having a second main surface, a bonding member bonding the first main surface and the second main surface, and a flow path positioned between the first substrate and the second substrate and extended in a parallel direction with the first main surface and the second main surface, and the bonding member has a projection which is protruded from a portion between the first main surface and the second main surface toward an inner part of the flow path, the flow path includes a first portion having the projection provided in an inner part and a second portion linked to the first portion adjacently to an opposite side to a side where the projection of the first portion is provided, and a height of the first substrate is greater than a height of the second portion in the thickness direction.

A ceramic-metal structure in which a metallic body (2) is inserted into or disposed above a through hole (4h) of a ceramic substrate (4) and which includes an annular pad layer (6) disposed around the through hole; an annular ring member (8) joined to the pad layer via a first brazing filler portion (10) and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion (12) intervening between the ring member and metallic body; and brazing filler flow prevention layers (7a, 7b) covering an outer surface of the pad layer so as to expose a central region (6c) of the outer surface of the pad layer facing the first brazing filler portion. The first brazing filler portion joins the central region and the ring member without projecting to a radially inner or outer side of the flow prevention layers.