A seal system includes a ceramic component, a metallic component, a silicon-containing layer, and a barrier layer. The ceramic component has a first surface region that defines a first surface roughness. The metallic component is situated adjacent to the first surface region and has a second surface region facing the first surface region. The silicon-containing layer is on the first surface region of the ceramic component and has a contact surface that defines a second surface roughness which is less than the first surface roughness. The barrier layer is on the metallic component and in contact with the silicon-containing layer and serves to limit interaction between silicon of the silicon-containing layer and the metallic component. The barrier layer includes at least one of alumina or MCrAlY.

A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.

A wiring substrate includes an insulating substrate, a conductor layer and an interlayer. The insulating substrate contains AlN. The conductor layer contains Cu. The interlayer is located between the insulating substrate and the conductor layer. In the interlayer, between a first region near the insulating substrate and a second region near the conductor layer, Cu concentration is higher in the second region than in the first region, and Al concentration is higher in the first region than in the second region.

A honeycomb structure including a plurality of porous honeycomb block bodies bound via joining material layers A. Each of the porous honeycomb block bodies includes a plurality of porous honeycomb segments bound via joining material layers B, each of the porous honeycomb segment includes: partition walls that defines a plurality of cells to form flow paths for a fluid, each of cells extending from an inflow end face that is an end face on a fluid inflow side to an outflow end face that is an end face on a fluid outflow side; and an outer peripheral wall located at the outermost periphery. At least a part of the joining material layers A has higher toughness than that of the joining material layers B.

A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.

A method allows for firm joining of power module components even if a joining area is large. The method includes: forming an oxygen ion conductor layer on a surface of one of a first member to be joined containing metal and a second member to be joined containing ceramic and a metal plating layer on a surface of the other; arranging them so that they are in contact with each other; connecting one of the first member to be joined and the second member to be joined on which the metal plating layer is provided to the negative electrode side of the voltage application device and the other to the positive electrode side; and applying a voltage between the first member to be joined and the second member to be joined to join them together.

A shell and a method for processing the shell are provided. The method includes: coating a sol prepared in advance on an inner surface of a ceramic shell prepared in advance; sintering the ceramic shell coated with the sol by using a sintering process, and forming a transition layer having nano-sized micro-pores on the inner surface of the ceramic shell.

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

The invention relates to a blank from a ceramic material, wherein at least two layers of ceramic material of different compositions are filled into a die layer-by-layer and after filling of the layers they are then pressed and sintered, wherein after filling of a first layer this is structured on its surface in such a way that the first layer, viewed across its surface, differs in its height from region to region, and then a layer with a composition that differs from the first layer is filled as a second layer into the mold.

Cold sintering of materials includes using a process of combining at least one inorganic compound, e.g., ceramic, in particle form with a solvent that can partially solubilize the inorganic compound to form a mixture; and applying pressure and a low temperature to the mixture to evaporate the solvent and densify the at least one inorganic compound to form sintered materials.