A component according to an example embodiment of the present disclosure includes first and second layers, the first and second layers each including ceramic-based fibers arranged in a ceramic-based matrix material, and nanofibers arranged between the first and second layers. An alternate component and a method of forming a component are also disclosed.

A honeycomb structure, including: a plurality of pillar shaped honeycomb segments, each of the pillar shaped honeycomb segments including a partition wall and a plugged portion; and a joining layer arranged so as to join side surfaces of the pillar shaped honeycomb segments to each other. The honeycomb structure satisfies the following equations (1) to (3):

y≤1000  (1);

y≤717.92x.sup.−0.095  (2); and

y≥462.4x.sup.−0.153  (3),

in which y is a maximum temperature (° C.) at which the use of the honeycomb structure is accepted, and x is a thermal conduction factor represented by the following equation:

thermal conduction factor=(thermal conductivity of the partition wall×thermal conductivity of the joining layer)/(average thickness of the joining layer×porosity of the partition wall).

A method of manufacturing an electrostatic chuck includes: preparing a first ceramic plate having a first hole formed therein; preparing a second ceramic plate having a second hole formed at a position different from a position of the first hole in a horizontal direction; forming a first slurry layer on the first ceramic plate or the second ceramic plate with a first slurry, the first slurry layer having a flow path formed therein to connect the first hole and the second hole; stacking the first ceramic plate and the second ceramic plate one above the other via the first slurry layer, and bonding the first ceramic plate and the second ceramic plate stacked one above the other via the first slurry layer.

An example article may include a component, a substrate including a first ceramic, a joining layer between the component and the substrate, and a joint surface coating between the substrate and the joining layer. The joint surface coating may include a diffusion barrier layer including a second ceramic material, and a compliance layer including at least one of a metal or a metalloid. An example technique may include holding a first joining surface of a coated component adjacent a second joining surface of a second component. The example technique may further include heating at least one of the coated component, the second component, and a braze material, and brazing the coated component by allowing the braze material to flow in a region between the first joining surface and the second joining surface.

This patent document relates to systems, structures, devices, and fabrication processes for ceramic matrix composites suitable for use in a nuclear reactor environment and other applications requiring materials that can withstand high temperatures and/or highly corrosive environments. In one exemplary aspect, a method of joining and sealing ceramic structures is disclosed. The method comprises forming a joint of a ceramic structure and an end plug using a sealing material, wherein the end plug has a hole that goes through a top surface and a bottom surface of the end plug; filling the ceramic structure with a desired gas composition through the hole; heating a material into a molten form using a heat source; and directing the material into the hole, wherein the material solidifies to seal the end plug.

A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.

A method to produce a protective surface layer having a predetermined topography on a ceramic matrix composite is described. The method includes applying a slurry layer to a surface of a fiber preform, and drying the slurry layer to form a particulate layer. A surface of the particulate layer is machined to improve surface smoothness and to form a machined surface. A ceramic tape is attached to the machined surface, and a tool comprising one or more features to be imprinted is placed on the ceramic tape, thereby forming a compression assembly. Heat and pressure are applied to the compression assembly to consolidate and bond the ceramic tape to the machined surface, while the one or more features of the tool are imprinted. Thus, a protective surface layer having a predetermined topography is formed.

A method for joining carbide ceramic particles, comprising: forming a first mixture comprising carbide ceramic particles, preceramic polymer liquid, fine carbon particles and metal nanoparticles that form a eutectic liquid at temperatures below 1400 C.; and heating the first mixture at a temperature of about 1150 C. to about 1400 C.

A filter including a plurality of pillar-shaped honeycomb structure segments made of porous ceramics, side faces of the segments being bonded together via a bonding material, wherein each of the pillar-shaped honeycomb structure segments includes an outer peripheral side wall, and partition walls partitioning a plurality of cells extending from a first end face to a second end face, and in each of the pillar-shaped honeycomb structure segments, an average porosity of the outer peripheral side wall is lower than that of the partition walls.

A material composite is provided, wherein the material composite includes a first layer formed at least of a ceramic first material, and a second layer arranged on the first layer and formed at least of a ceramic second material that is different from the first material. In order to achieve a higher thermal and/or mechanical load capacity, the material composite further includes a connection layer arranged between the first layer and the second layer, and connects the first layer to the second layer. The connection layer is formed at least partially of a molybdenum-titanium carbide composite material.