A bonded body is provided in which an aluminum alloy member formed from an aluminum alloy, and a metal member formed from copper, nickel, or silver are bonded to each other. The aluminum alloy member is constituted by an aluminum alloy in which a concentration of Si is in a range of 1 mass % to 25 mass %. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A compound layer, which is formed through diffusion of Al of the aluminum alloy member and a metal element of the metal member, is provided at a bonding interface between the aluminum alloy member and the metal member. A Mg-concentrated layer, in which a concentration of Mg is to 3 mass % or greater, is formed at the inside of the compound layer, and the thickness of the Mg-concentrated layer is in a range of 1 m to 30 m.

The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.

A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an AgCu eutectic structure layer 32 having a thickness of 15 m or less that is formed between the nitride layer and the copper plate.

A bonded body is provided in which an aluminum alloy member formed from an aluminum alloy, and a metal member formed from copper, nickel, or silver are bonded to each other. The aluminum alloy member is constituted by an aluminum alloy in which a concentration of Si is in a range of 1 mass % to 25 mass %. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A compound layer, which is formed through diffusion of Al of the aluminum alloy member and a metal element of the metal member, is provided at a bonding interface between the aluminum alloy member and the metal member. A Mg-concentrated layer, in which a concentration of Mg is to 3 mass % or greater, is formed at the inside of the compound layer, and the thickness of the Mg-concentrated layer is in a range of 1 m to 30 m.

A power module substrate 10 is provided with: an insulating substrate 1; and a metal sheet 2 that is joined to the insulating substrate 1 via a brazing material 3, wherein regarding the surface roughness, in the thickness direction, of the lateral surface of the metal sheet 2, the surface roughness of a corner 2a farthest from the center of the metal sheet 2 is larger than the surface roughness of plane parts 2b, which bound the corner, in at least a plan view. Also provided is a power module 100 which is formed by mounting an electronic component 40 on this power module substrate 10.

A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

A method for fabricating assemblies that includes providing a first component that further includes silicon carbide and that has an upper portion and a tapered lower portion; providing a second component that further includes silicon carbide and that has an upper portion that is adapted to receive the tapered lower portion of the first component; providing a predetermined amount of multiphase AlSi braze foil; grinding the AlSi braze foil into a powder; mixing a predetermined amount of braze paste binder with the AlSi powder to form a slurry; uniformly applying the slurry to the tapered lower portion of the first component; uniformly applying the slurry to the upper portion of the second component and inserting the tapered lower portion of the first component into the upper portion of the second component; and heating the applied slurry to a temperature of 725 C. to 1450 C. for a predetermined period of time.

In some examples, a method including positioning a first ceramic or ceramic matrix composite (CMC) part and a second ceramic or CMC part adjacent to each other to define a joint between adjacent portions of the first ceramic or CMC part and the second ceramic or CMC part; and depositing an aqueous braze paste at least one of in the joint or adjacent the joint, wherein the aqueous braze paste comprises water, a water-soluble polymeric binder, and a silicon-based powder alloy.