C04B2237/341

Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

LAMINATED CERAMIC SINTERED BODY BOARD FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, CHIP RESISTOR, AND METHOD FOR MANUFACTURING CHIP RESISTOR

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

Repair and/or reinforcement of oxide-oxide CMC

In some examples, techniques of repairing and/or reinforcing oxide-oxide ceramic matrix composite (CMC) materials using a metallic material. In one example, a method including applying a metallic material at an edge of an oxide-oxide CMC substrate; and heating the metallic material to diffuse the metal material into the oxide-oxide CMC substrate at the edge. In another example, a method including applying a metallic material onto a damaged area of the oxide-oxide CMC; applying a reinforcing phase material onto the damaged area of the oxide-oxide CMC; and heating the metallic material to diffuse the metallic material into the oxide-oxide CMC and attach the reinforcing phase material to the damaged area of the oxide-oxide CMC.

HONEYCOMB BODY MANUFACTURING METHODS

Methods of firing ceramic honeycomb bodies are disclosed that include placing refractory particles on and end face of the green ceramic honeycomb body, and heating the green ceramic honeycomb body to a temperature of at least 600° C. to form a fired ceramic honeycomb body. The refractory particles prevents sticking of honeycomb-to-honeycomb during firing. A layer of refractory particles can also be used to replace a green cookie.

Additively manufactured casting core-shell mold and ceramic shell with variable thermal properties

A method of forming a cast component and a method of forming a casting mold. The method is performed by connecting at least one wax gate component to a ceramic core-shell mold. The ceramic core-shell mold includes at least a filter, first core portion, a first shell portion, and at least one first cavity between the core portion and the first shell portion. The core-shell mold may be manufactured using an additive manufacturing process and may include an integrated ceramic filter. At least a portion of the ceramic core-shell mold and the wax gate component is coated with a second ceramic material. The wax gate component is then removed to form a second cavity in fluid communication with the first cavity.

REFRACTORY ARTICLES AND METHODS FOR FORMING SAME

A refractory article includes a body having a first portion defining at least a portion of a first exterior surface of the body, the first portion including a carbide, and further including a second portion defining at least a portion of a second exterior surface of the body opposite the first exterior surface, the second portion including an oxide, and a thermal conductivity difference (ΔTC) of at least 10 W/mK between the first exterior surface and the second exterior surface, and an average Shell Temperature of not greater than 400° C.

CARBON-CERAMIC COMPOSITES, ELECTRODE COMPRISING THE SAME AND SECONDARY BATTERY COMPRISING THE ELECTRODE
20230327085 · 2023-10-12 ·

The present disclosure relates to a ceramic-carbon composite including a ceramic shell surrounding a hollow portion; and a carbon coating layer surrounding the ceramic shell, wherein the hollow portion is in a vacuum state, an electrode including the ceramic-carbon composite, and a secondary battery including the electrode. The ceramic-carbon composite of the present disclosure has excellent thermal barrier effect and electrical conductivity, and thus, when used in the electrode, non-ideal heat transfer between an electrode active material and an electrode current collector is blocked to prevent a thermal runaway phenomenon, to have an effect that can significantly improve safety of the secondary battery.

MATERIALS SYSTEMS FOR INHIBITING PENETRATION OF MOLTEN SALTS, METHODS THEREFOR, AND DEVICES PROVIDED THEREWITH
20210340070 · 2021-11-04 ·

Materials systems resistant to penetration of molten salts and may be present within a molten-salt-facing wall of a device for containing a molten salt bath at an elevated temperature, and molten-salt-facing walls and devices formed by such materials systems. A first layer of such a system defines an outer surface for direct contact with the molten salt bath, and resists erosion and corrosion and is penetrable by the molten salt at the elevated temperature. A second layer is located adjacent to the first layer and exhibits little or no wetting by the molten salt so that at least a portion of a thickness of the second layer is not penetrable by the molten salt. A third layer is located adjacent to the second layer and is porous and exhibits a low thermal conductivity at the elevated temperature.

MXene layers as substrates for growth of highly oriented perovskite thin films

The present disclosure is directed to using MXene compositions as templates for the deposition of oriented perovskite films, and compositions derived from such methods. Certain specific embodiments include methods preparing an oriented perovskite, perovskite-type, or perovskite-like film, the methods comprising: (a) depositing at least one perovskite, perovskite-type, or perovskite-like composition or precursor composition using chemical vapor deposition (CVD), physical vapor deposition (PVD), or atomic layer deposition (ALD) onto a film or layer of a MXene composition supported on a substrate to form a layered composition or precursor composition; and either (b) (1) heat treating or annealing the layered precursor composition to form a layered perovskite-type structure comprising at least one oriented perovskite, perovskite-type, or perovskite-like composition; or (2) annealing the layered composition; or (3) both (1) and (2).

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.