A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

An inter-turbine duct includes a first annular wall with a ceramic composite material and including a first plurality of layers and a second plurality of layers, the first plurality of layers including a slot extending therethrough; and a first vane with a material of a metal alloy or a ceramic material. The first vane has a first end and a flange extending through the slot with the flange extending away from the first end and being retained between the first plurality of layers and the second plurality of layers of the first annular wall.

A manufacturing method of a multilayer shell-core composite structural component comprises the following procedures: (1) respectively preparing feeding material for injection forming of a core layer, a buffer layer and a shell layer, wherein the powders of feeding material of the core layer and the shell layer are selected from one or more of metallic powder, ceramic powder or toughened ceramic powder, and are different from each other, and the powder of feeding material of the buffer layer is gradient composite material powder; (2) layer by layer producing the blank of multilayer shell-core composite structural component by powder injection molding; (3) degreasing the blank; and (4) sintering the blank to obtain the multilayer shell-core composite structural component. The multilayer shell-core composite structural component has the advantages of high surface hardness, abrasion resistance, uniform thickness of the shell layer, stable and persistent performance.

A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.

A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.

A system and method for forming a ceramic matrix composite blade track is provided. The method may include stacking a plurality of first plies to form a first porous preform layer, the first plies including a plurality of first ceramic fibers. The method may further include stacking a plurality of second plies to form a second porous preform layer, the second plies including a plurality of second ceramic fibers. The method may further include combining the first porous preform layer and the second porous preform layer to form a unified porous preform. The method may further include forming a structural layer by infiltrating the first porous preform with a first ceramic matrix material, and forming an abradable layer by infiltrating the second porous preform with a second ceramic matrix material.

There is provided a manufacturing method of a fluid flow straightening member having a structure in which disturbance of an air flow does not easily arise. In at least one of outermost layers of an outer circumferential surface or an inner circumferential surface which configures a tubular portion of the fluid flow straightening member, ceramic fibers are oriented in a direction along a plane including a central axis which is surrounded by the tubular portion.

A gas inlet suitable in particular for use in an ion thruster includes a housing which is made of a gas-tight ceramics material, and an insert which is arranged in the housing and is made of a porous ceramics material. The geometry and pore structure of the insert are such that the insert forms a desired flow resistance for a gas stream flowing through the insert.

A method for improving the heat resistance of a resistive element embedded in an alumina deposit covering a surface of a substrate, in which the alumina deposit includes a surface portion and a deep portion which is sandwiched between the surface portion and the surface of the substrate and in which the resistive element is located, is provided. The method includes a densification of the surface portion of the alumina deposit.

The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is formed on the other surface of the insulating substrate, in which the circuit layer has a first aluminum layer made of aluminum or an aluminum alloy which is bonded to the insulating substrate and a first copper layer made of copper or a copper alloy which is bonded to the first aluminum layer by solid-phase diffusion, the metal layer has a second aluminum layer made of aluminum or an aluminum alloy, and a relationship between a thickness t.sub.1 of the circuit layer and a thickness t.sub.2 of the second aluminum layer of the metal layer satisfy t.sub.1<t.sub.2.