Patent classifications
C04B2237/361
Thermal conductive member and heat dissipation structure including the same
A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
HYDROTHERMAL-ASSISTED TRANSIENT JET FUSION ADDITIVE MANUFACTURING
Various embodiments of the present disclosure provide an additive manufacturing method. The method includes forming a first layer of a first ceramic material and forming a second layer of a second ceramic material. The method further includes contacting the first layer of the first ceramic material, the second layer of the second ceramic material, or both with a saturant. The method further includes heating the first layer of the first ceramic material, the second layer of the second ceramic material, or both to a temperature in a range of from about 50° C. to about 300° C. The method further includes applying pressure to the first layer of the first ceramic material, the second layer of the second ceramic material, or both. The pressure can be in a range of from about 10 kPa to about 800 MPa. The method further includes at least partially dissolving a portion of an external surface of a ceramic particle of the first layer of the first ceramic material, the second layer of the second ceramic material, or both. The method further includes fusing a portion of the dissolved portion of the external surface of the ceramic particle to from a product having a density in a range of from about 65% to about 100% relative to a corresponding fully densified product and optionally containing no organic binder.
ALUMINUM NITRIDE SINTERED BODY, METHOD OF MAKING THE SAME, AND SEMICONDUCTOR MANUFACTURING EQUIPMENT COMPONENT USING ALUMINUM NITRIDE SINTERED BODY
An aluminum nitride sintered body for use in a semiconductor manufacturing apparatus is provided. The aluminum nitride sintered body exhibits, in a photoluminescence spectrum thereof in a wavelength range of 350 nm to 700 nm obtained with 250 nm excitation light, a highest emission intensity peak within a wavelength range of 580 nm to 620 nm.
CBN SINTERED COMPACT AND CUTTING TOOL
A cBN sintered compact has cubic boron nitride particles and a ceramic binder phase, and in the sintered compact, WSi.sub.2 having an average particle diameter of 10 nm to 200 nm is dispersed such that a content thereof is 1 vol % to 20 vol %. A cutting tool has the cBN sintered compact as a tool body.
TEMPORARY BONDING BODY OF CERAMIC RESIN COMPOSITE AND METAL PLATE, METHOD FOR PRODUCING SAME, OBJECT TO BE TRANSPORTED INCLUDING THE TEMPORARY BONDING BODY, AND METHOD FOR TRANSPORTING SAME
A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.
Flexible hermetic membranes with electrically conducting vias
Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.
SUPERHARD CONSTRUCTIONS & METHODS OF MAKING SAME
A super hard polycrystalline construction has a first region having a body of thermally stable polycrystalline super hard material with an exposed surface forming a working surface, and a peripheral side edge, a second region forming a substrate to the first region and a third region interposed between the first and second regions. The third region extends across a surface of the second region along an interface and has a composite material having a first phase comprising a plurality of non-intergrown diamond grains, the majority of the diamond grains having a coating comprising nano-sized BN particles. There is also disclosed a method of making such a construction.
Hexagonal boron nitride/cement/polymer composites and methods of synthesis
Hexagonal Boron Nitride (hBN) is a synthetic material that may be used in several applications due to its chemical inertness, thermal stability, and other beneficial properties. hBN composite materials and method for making such composites are described here. In particular composite materials including both functionalized hBN and cement or cementitious materials and methods for making the same are discussed. Such materials may be useful for construction, well cementing (both primary and remedial cementing), nuclear industry, 3D printing of advanced multifunctional composites, and refractory materials.
Chemically strengthened bond between thermally stable polycrystalline hard materials and braze material
Chemical methods, optionally in combination with physical methods, may be used to increase the strength of the bond formed by a braze material between a polycrystalline material and a hard composite. Such polycrystalline materials brazed to hard composites may be found in various wellbore tools include drill bit cutters. An exemplary method may include forming a bonding layer on a bonding surface of a polycrystalline material body that comprises a hard material, the bonding surface opposing a contact surface of the polycrystalline material body, and the bonding layer substantially formed by a [111] crystal structure of the hard material, a [100] crystal structure of the hard material, or a combination thereof; and brazing the bonding layer to a hard composite using a braze material.
Super-hard constructions, methods for making same and method for processing same
A construction comprising a sintered polycrystalline super-hard layer having mutually opposite reinforced boundaries, each of which is bonded to a respective reinforcement structure, in which the super-hard layer includes polycrystalline diamond (PCD) material or polycrystalline cubic boron nitride (PCBN) material. The construction will be configured such that the equivalent circle diameter of each reinforced boundary is at least ten times the mean thickness of the super-hard layer between them. The reinforcement structures will be substantially free of material having a melting point of less than 2,000 degrees Celsius, at least adjacent the reinforced boundaries.