Disclosed are a multi-layer composite ceramic plate and a manufacturing method thereof. The composite ceramic plate includes at least one basic sandwich structure. The manufacturing method includes: preparing a sheet-like green body with ceramic powders; pre-sintering the green body at a pre-sintering temperature lower than the sintering temperature to obtain a pre-sintered ceramic member with certain strength; forming a metal electrode layer on an upper surface of the pre-sintered ceramic member; placing the pre-sintered ceramic member in a mold, with the upper surface coated with the metal electrode layer facing upwards; providing a ceramic precursor layer on the upper surface of the pre-sintered ceramic member; carrying out hot-pressing sintering in the axial direction of the pre-sintered ceramic member at the sintering temperature to form an integral structure, wherein by the hot-pressing sintering, a second ceramic layer is formed by the pre-sintered ceramic member, a first ceramic layer is formed by the ceramic precursor layer, and the metal electrode layer is located between the first ceramic layer and the second ceramic layer to from a basic sandwich structure together with the first ceramic layer and the second ceramic layer.

An example article may include a component, a substrate including a first ceramic, a joining layer between the component and the substrate, and a joint surface coating between the substrate and the joining layer. The joint surface coating may include a diffusion barrier layer including a second ceramic material, and a compliance layer including at least one of a metal or a metalloid. An example technique may include holding a first joining surface of a coated component adjacent a second joining surface of a second component. The example technique may further include heating at least one of the coated component, the second component, and a braze material, and brazing the coated component by allowing the braze material to flow in a region between the first joining surface and the second joining surface.

A hybrid sandwich ceramic matrix composite (CMC) may comprise a first facesheet, a second facesheet, and a core between and bonded to both of the first facesheet and the second facesheet. The first facesheet and the second facesheet may each include filaments in a ceramic matrix. The hybrid sandwich CMC may be configured for exposure to a thermal gradient in which the first facesheet is exposed to a higher temperature environment than the second facesheet. The first facesheet and the second facesheet may have at least closely matching coefficients of thermal expansion, and the first facesheet may have a higher compressive strength than the second facesheet.

A method of manufacturing an epitaxy substrate is provided. A handle substrate is provided. A beveling treatment is performed on an edge of a device substrate such that a bevel is formed at the edge of the device substrate, wherein a thickness of the device substrate is greater than 100 μm and less than 200 μm. An ion implantation process is performed on a first surface of the device substrate to form an implantation region within the first surface. A second surface of the device substrate is bonded to the handle substrate for forming the epitaxy substrate, wherein a bonding angle greater than 90° is provided between the bevel of the device substrate and the handle substrate, and a projection length of the bevel toward the handle substrate is between 600 μm and 800 μm.

In some examples, a method including forming a layer of a slurry composition between a first ceramic or CMC part and a second ceramic or CMC part. The slurry composition includes a carrier material; and a plurality of solid particles in the carrier material. The plurality of solid particles includes first silicon carbide (SiC) particles defining a first average particle size, second SiC particles defining a second average particles size that is less than the first average particles size, and reactive additive particles. The method includes heating the layer of slurry composition to react the plurality of reactive additive particles to fuse the plurality of first SiC particles and the plurality of second SiC particles together with the reactive additive particles, wherein the fused layer of the slurry composition forms a joint layer that joins the first ceramic or CMC part to the second ceramic or CMC part.

The honeycomb filter of the present invention comprises a ceramic honeycomb substrate formed from a porous body of sintered ceramic particles, and a filter layer formed on the surface of the cell walls, wherein a portion of the filter layer penetrates from the surface of the cell walls into pores formed by the ceramic particles to form inter-particle filtration bodies, these inter-particle filtration bodies are formed from a plurality of spherical ceramic particles and crosslinking bodies which bind the spherical ceramic particles to each other, and the spherical ceramic particles and the crosslinking bodies form a three-dimensional network structure.

A bulletproof panel includes: (i) a ceramic plate A; (ii) at least one phenol resin impregnated aramid fabric laminate C having phenol resin impregnated aramid fabrics C1, C2 and C3 which are laminated thereon; and (iii) an epoxy resin impregnated fabric B disposed between the ceramic plate A and the phenol resin impregnated aramid fabric laminate C, and impregnated with an epoxy resin. The phenol resin impregnated aramid fabrics C1, C2 and C3 may be aramid fabrics impregnated with a phenol resin, and aramid fabrics impregnated with a phenol/polyvinyl butyral mixture resin. The ceramic plate A and the phenol resin impregnated aramid fabric laminate C are not delaminated from each other even under a high-temperature environment, and thereby greatly enhancing the bulletproof performance.

A method of forming one or more high temperature co-fired ceramic articles, comprising the steps of:— a) forming a plurality of green compacts, by a process comprising dry pressing a powder comprising ceramic and organic binder to form a green compact; b) disposing a conductor or conductor precursor to at least one surface of at least one of the plurality of green compacts to form at least one patterned green compact; c) assembling the at least one patterned green compact with one or more of the plurality of green compacts or patterned green compacts or both to form a laminated assembly; d) isostatically pressing the laminated assembly to form a pressed laminated assembly; e) firing the pressed laminated assembly at a temperature sufficient to sinter the ceramic layers together.

Hybrid composite materials including carbon nanotube sheets and flexible ceramic materials, and methods of making the same are provided herein. In one embodiment, a method of forming a hybrid composite material is provided, the method including: placing a layer of a first flexible ceramic composite on a lay-up tooling surface; applying a sheet of a pre-preg carbon fiber reinforced polymer on the flexible ceramic composite; curing the flexible ceramic composite and the pre-preg carbon fiber reinforced polymer sheet together to form a hybrid composite material; and removing the hybrid composite material from the lay-up tooling surface, wherein the first flexible ceramic composite comprises an exterior surface of the hybrid composite material.

A honeycomb structure, including: a plurality of pillar shaped honeycomb segments, each of the pillar shaped honeycomb segments including a partition wall and a plugged portion; and a joining layer arranged so as to join side surfaces of the pillar shaped honeycomb segments to each other. The honeycomb structure satisfies the following equations (1) to (3):
y≤1000  (1);
y≤717.92x.sup.−0.095  (2); and
y≥462.4x.sup.−0.153  (3),
in which y is a maximum temperature (° C.) at which the use of the honeycomb structure is accepted, and x is a thermal conduction factor represented by the following equation:
thermal conduction factor=(thermal conductivity of the partition wall×thermal conductivity of the joining layer)/(average thickness of the joining layer×porosity of the partition wall).