The invention relates to a compound or a salt thereof, a method for preparation thereof, and use thereof, wherein the compound has the structure of Formula (1):

##STR00001## the substituents in Formula (1) are as defined in the specification. The compound of Formula (1) or a salt thereof can be attached to a solid-phase resin, on which solid-phase synthesis may be performed.

The invention relates to a compound or a salt thereof, a method for preparation thereof, and use thereof, wherein the compound has the structure of Formula (1):

##STR00001## the substituents in Formula (1) are as defined in the specification. The compound of Formula (1) or a salt thereof can be attached to a solid-phase resin, on which solid-phase synthesis may be performed.

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

Disclosed is a diamine compound represented by Formula (1),

##STR00001## in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.

Disclosed is a diamine compound represented by Formula (1),

##STR00001## in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.

A process of forming a flame retardant material is disclosed. The process includes forming a functionalized polybrominated diphenyl-based flame retardant compound having the following structural formula: ##STR00001## In the structural formula, X corresponds to a functional group. The process also includes forming a flame retardant material by covalently bonding the functionalized polybrominated diphenyl-based flame retardant compound into a material using the functional group.

A process of forming a flame retardant material is disclosed. The process includes forming a functionalized polybrominated diphenyl-based flame retardant compound having the following structural formula: ##STR00001## In the structural formula, X corresponds to a functional group. The process also includes forming a flame retardant material by covalently bonding the functionalized polybrominated diphenyl-based flame retardant compound into a material using the functional group.

A process of forming a flame retardant material is disclosed. The process includes forming a functionalized polybrominated diphenyl-based flame retardant compound having the following structural formula: ##STR00001## In the structural formula, X corresponds to a functional group. The process also includes forming a flame retardant material by covalently bonding the functionalized polybrominated diphenyl-based flame retardant compound into a material using the functional group.

The present invention relates phenoxyhalogenphenylamidines of the general formula (I), to a process for their preparation, to the use of the amidines according to the invention for controlling unwanted microorganisms and also to an agrochemical formulation for this purpose, comprising the phenoxyhalogenphenylamidines according to the invention. Furthermore, the invention relates to a method for controlling unwanted microorganisms by applying the compounds according to the invention to the microorganisms and/or their habitat.

The present invention relates phenoxyhalogenphenylamidines of the general formula (I), to a process for their preparation, to the use of the amidines according to the invention for controlling unwanted microorganisms and also to an agrochemical formulation for this purpose, comprising the phenoxyhalogenphenylamidines according to the invention. Furthermore, the invention relates to a method for controlling unwanted microorganisms by applying the compounds according to the invention to the microorganisms and/or their habitat.