A 4-(p-trifluoromethylbenzyl)-3-fluoro-1,2,4-triphenylamine derivative, a pharmaceutical composition and applications thereof are disclosed. The general chemical formula of the derivative is shown in formula I, where, R is a C.sub.1-C.sub.6 alkyl group, a cycloalkyl group, a heteroatom-containing cycloalkyl group, an aryl group or a heteroatom-containing aryl group, the heteroatom is selected from N or O, and the n is 0, 1, 2 or 3. The pharmaceutical composition contains any one of the above-mentioned 4-(p-trifluoromethylbenzyl)-3-fluoro-1,2,4-triphenylamine derivatives as an active ingredient, and one or more pharmaceutically acceptable carriers. The derivative and the pharmaceutical composition activate KCNQ channel currents. Thus, the derivative can be applied to prepare a KCNQ potassium channel opener, and can be used as the active ingredients of an antiepileptic pharmaceutical preparation, an antianxiety pharmaceutical preparation and a neuropathic pain-relieving pharmaceutical preparation.

This invention relates to certain compounds or pharmaceutically acceptable salts thereof, and for the use of the compounds to treat cancer. In another aspect, the disclosure relates to a pharmaceutical composition comprising a compound of Formula (1), Formula (1a), or Formula (1b), or a pharmaceutically acceptable salt thereof, and at least one of a pharmaceutically acceptable carrier, diluent or excipient.

This invention relates to certain compounds or pharmaceutically acceptable salts thereof, and for the use of the compounds to treat cancer. In another aspect, the disclosure relates to a pharmaceutical composition comprising a compound of Formula (1), Formula (1a), or Formula (1b), or a pharmaceutically acceptable salt thereof, and at least one of a pharmaceutically acceptable carrier, diluent or excipient.

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: ##STR00001##
wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO).sub.n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO).sub.n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: ##STR00001##
wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO).sub.n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO).sub.n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

A method for producing a compound represented by formula (C) wherein R.sup.1 represents an amino group protected with a protecting group, the method comprising a step of subjecting a compound represented by formula (B) wherein R.sup.1 represents the same meaning as above, to intramolecular cyclization to convert the compound into the compound represented by formula (C). ##STR00001##

A method for producing a compound represented by formula (C) wherein R.sup.1 represents an amino group protected with a protecting group, the method comprising a step of subjecting a compound represented by formula (B) wherein R.sup.1 represents the same meaning as above, to intramolecular cyclization to convert the compound into the compound represented by formula (C). ##STR00001##

A catalyst includes a carrier, and a metal obtained by reducing a metal ion supported on the carrier 1) in a supercritical state or 2) in a polar organic solvent, wherein the carrier is an inorganic porous body having a hierarchical porous structure. By employing the catalyst, it is possible to exhibit better catalytic activity than a conventional catalyst. Heat generation and spontaneous ignition are prevented because no organic porous body is used.