Patent classifications
C07C235/20
Photo-cleavable primer compositions and methods of use
In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: ##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
Photo-cleavable primer compositions and methods of use
In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: ##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
SURFACE PRIMER COMPOSITIONS AND METHODS OF USE
In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II:
##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
SURFACE PRIMER COMPOSITIONS AND METHODS OF USE
In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II:
##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
Thermosetting polyimides derived from resveratrol
A method for making thermosetting polyimides from resveratrol including converting resveratrol to trisaniline, reacting trisaniline with one or more dianhydride and thermosetting endcap to form amic acid, thermally imidizing amic acid to form polyimide oligomer, and cross-linking polyimide oligomer with heat and pressure to generate polyimide thermoset.
Surface primer compositions and methods of use
In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: ##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
Surface primer compositions and methods of use
In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: ##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
Treprostinil derivative compounds and methods of using same
Compounds represented by formulae I, II, III, and IV including pro-drugs for treprostinil and prostacyclin analogs. Uses include treatment of pulmonary hypertension (PH) or pulmonary arterial hypertension (PAH). The structures of the compounds can be adapted to the particular application for a suitable treatment dosage. Transdermal applications can be used.
Treprostinil derivative compounds and methods of using same
Compounds represented by formulae I, II, III, and IV including pro-drugs for treprostinil and prostacyclin analogs. Uses include treatment of pulmonary hypertension (PH) or pulmonary arterial hypertension (PAH). The structures of the compounds can be adapted to the particular application for a suitable treatment dosage. Transdermal applications can be used.
Surface primer compositions and methods of use
In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: ##STR00001##
wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.