The present disclosure is generally directed to an open time additive composition that includes at least two, different open time additives having the structure of Compound I, a salt thereof, or both. Compound I having the following formula:

##STR00001##

The present disclosure is generally directed to an open time additive composition that includes at least two, different open time additives having the structure of Compound I, a salt thereof, or both. Compound I having the following formula:

##STR00001##

The present invention is a material for forming an organic film, including: a compound shown by the following general formula (1); and an organic solvent, where in the general formula (1), X represents an organic group with a valency of “n” having 2 to 50 carbon atoms or an oxygen atom, “n” represents an integer of 1 to 10, and R.sub.1 independently represents any of the following general formulae (2), where in the general formulae (2), broken lines represent attachment points to X, and Q.sub.1 represents a monovalent organic group containing a carbonyl group, at least a part of which is a group shown by the following general formulae (3), where in the general formulae (3), broken lines represent attachment points, X.sub.1 represents a single bond or a divalent organic group having 1 to 20 carbon atoms optionally having a substituent when the organic group has an aromatic ring, R.sub.2 represents a hydrogen atom, a methyl group, an ethyl group, or a phenyl group, and ** represents an attachment point. An object of the present invention is to provide a material for forming an organic film for forming an organic film having dry etching resistance, and also having high filling and planarizing properties and adhesion to a substrate. ##STR00001##

The present invention is a material for forming an organic film, including: a compound shown by the following general formula (1); and an organic solvent, where in the general formula (1), X represents an organic group with a valency of “n” having 2 to 50 carbon atoms or an oxygen atom, “n” represents an integer of 1 to 10, and R.sub.1 independently represents any of the following general formulae (2), where in the general formulae (2), broken lines represent attachment points to X, and Q.sub.1 represents a monovalent organic group containing a carbonyl group, at least a part of which is a group shown by the following general formulae (3), where in the general formulae (3), broken lines represent attachment points, X.sub.1 represents a single bond or a divalent organic group having 1 to 20 carbon atoms optionally having a substituent when the organic group has an aromatic ring, R.sub.2 represents a hydrogen atom, a methyl group, an ethyl group, or a phenyl group, and ** represents an attachment point. An object of the present invention is to provide a material for forming an organic film for forming an organic film having dry etching resistance, and also having high filling and planarizing properties and adhesion to a substrate. ##STR00001##

Provided is an organic nanoparticle production method comprising a step in which a mixture of beads having an average particle size at least 0.15 mm and no more than a value (mm) calculated by the formula 1.07−0.11×[outer peripheral speed of the stirring rotor (m/sec)] and a slurry containing organic particles is stirred by a stirring rotor rotating at an outer peripheral speed of 7 m/sec or less in a vessel of a wet bead mill.

Processes for chemical functionalization of materials are described. The processes generally include chemical reaction between a thiol group of a first compound or material and an alkene group or alkyne group of a second compound or material. Also disclosed are functionalized materials and compounds suitable for functionalizing a material.

Processes for chemical functionalization of materials are described. The processes generally include chemical reaction between a thiol group of a first compound or material and an alkene group or alkyne group of a second compound or material. Also disclosed are functionalized materials and compounds suitable for functionalizing a material.

Processes for chemical functionalization of materials is described. The processed generally include chemical reaction between a thiol group of a first compound or material and an alkane group or alkyne group of a second compound or material. Also disclosed are functionalized materials and compounds suitable for functionalizing a material.

Processes for chemical functionalization of materials is described. The processed generally include chemical reaction between a thiol group of a first compound or material and an alkane group or alkyne group of a second compound or material. Also disclosed are functionalized materials and compounds suitable for functionalizing a material.

Provided herein are dUTPase inhibitors, compositions comprising such compounds and methods of using such compounds and compositions.