An object of the present invention is to provide a transfer film capable of suppressing a corrosion of a wiring line and an electrode. In addition, an object of the present invention is to provide a method for producing a laminate using the transfer film. In addition, an object of the present invention is to provide a novel blocked isocyanate compound. The transfer film of the present invention has a temporary support and a photosensitive composition layer disposed on the temporary support, in which the photosensitive composition layer includes an alkali-soluble resin, a polymerizable compound, a polymerization initiator, and a blocked isocyanate compound having an NCO value of 4.5 mmol/g or more.

The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising (i) copper (II) ions, (ii) one or more than one suppressor consisting of or comprising one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises one or more than one linear or branched polyalkylene glycol moiety, and/or one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety, with the proviso that if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms;
a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above.

A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I):

##STR00001## (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, X in formula (I) is a C.sub.1 to C.sub.10 straight or branched alkylene, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I):

##STR00001## (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, X in formula (I) is a C.sub.1 to C.sub.10 straight or branched alkylene, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

A resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1, and a solvent. A method of forming patterns uses the resist underlayer composition under a photoresist pattern to enhance the sensitivity of the photoresist to an exposure light source, thereby providing enhanced resolution and faster processing times. ##STR00001##

A catalyst system comprising a combination of: 1) an activator; 2) one or more metallocene catalyst compounds; 3) a support comprising an organosilica material, which is a mesoporous organosilica material. The organosilica material is a polymer of at least one monomer of Formula [Z.sup.1OZ.sup.2 SiCh.sub.2].sub.3(i), where Z.sup.1 represents a hydrogen atom, a C1-C4 alkyl group, or a bond to a silic-on atom of another monomer and Z.sup.2 represents a hydroxyl group, a C.sub.1-C.sub.4alkoxy group, a C.sub.1-C.sub.6 salkyl group, or an oxygen atom bonded to a silicon atom of another monomer. This invention further relates to processes to polymerize olefins comprising contacting one or more olefins with the above catalyst system.

A catalyst system comprising a combination of: 1) an activator; 2) one or more metallocene catalyst compounds; 3) a support comprising an organosilica material, which is a mesoporous organosilica material. The organosilica material is a polymer of at least one monomer of Formula [Z.sup.1OZ.sup.2 SiCh.sub.2].sub.3(i), where Z.sup.1 represents a hydrogen atom, a C1-C4 alkyl group, or a bond to a silic-on atom of another monomer and Z.sup.2 represents a hydroxyl group, a C.sub.1-C.sub.4alkoxy group, a C.sub.1-C.sub.6 salkyl group, or an oxygen atom bonded to a silicon atom of another monomer. This invention further relates to processes to polymerize olefins comprising contacting one or more olefins with the above catalyst system.

Disclosed is a process for the preparation of toltrazuril of formula (I) via the intermediate N-methyl-N′-[3-methyl-4-[4-[(trifluoromethyl)thio]phenoxy]phenyl] imidodicarbonic diamide of formula (III)

##STR00001## wherein intermediate (III) is obtained via a novel intermediate without the use of potentially hazardous reagents or potentially unstable intermediates.

Disclosed is a process for the preparation of toltrazuril of formula (I) via the intermediate N-methyl-N′-[3-methyl-4-[4-[(trifluoromethyl)thio]phenoxy]phenyl] imidodicarbonic diamide of formula (III)

##STR00001## wherein intermediate (III) is obtained via a novel intermediate without the use of potentially hazardous reagents or potentially unstable intermediates.

The present invention relates to compounds and methods useful as inhibitors of phosphodiesterase 4 (PDE4) for the treatment or prevention of disease.