The present invention relates to compounds and methods useful as inhibitors of phosphodiesterase 4 (PDE4) for the treatment or prevention of inflammatory diseases and other diseases involving elevated levels of cytokines and proinflammatory mediators.

The present invention is a material for forming an organic film, including: a compound shown by the following general formula (1); and an organic solvent, where in the general formula (1), X represents an organic group with a valency of “n” having 2 to 50 carbon atoms or an oxygen atom, “n” represents an integer of 1 to 10, and R.sub.1 independently represents any of the following general formulae (2), where in the general formulae (2), broken lines represent attachment points to X, and Q.sub.1 represents a monovalent organic group containing a carbonyl group, at least a part of which is a group shown by the following general formulae (3), where in the general formulae (3), broken lines represent attachment points, X.sub.1 represents a single bond or a divalent organic group having 1 to 20 carbon atoms optionally having a substituent when the organic group has an aromatic ring, R.sub.2 represents a hydrogen atom, a methyl group, an ethyl group, or a phenyl group, and ** represents an attachment point. An object of the present invention is to provide a material for forming an organic film for forming an organic film having dry etching resistance, and also having high filling and planarizing properties and adhesion to a substrate. ##STR00001##

The present invention is a material for forming an organic film, including: a compound shown by the following general formula (1); and an organic solvent, where in the general formula (1), X represents an organic group with a valency of “n” having 2 to 50 carbon atoms or an oxygen atom, “n” represents an integer of 1 to 10, and R.sub.1 independently represents any of the following general formulae (2), where in the general formulae (2), broken lines represent attachment points to X, and Q.sub.1 represents a monovalent organic group containing a carbonyl group, at least a part of which is a group shown by the following general formulae (3), where in the general formulae (3), broken lines represent attachment points, X.sub.1 represents a single bond or a divalent organic group having 1 to 20 carbon atoms optionally having a substituent when the organic group has an aromatic ring, R.sub.2 represents a hydrogen atom, a methyl group, an ethyl group, or a phenyl group, and ** represents an attachment point. An object of the present invention is to provide a material for forming an organic film for forming an organic film having dry etching resistance, and also having high filling and planarizing properties and adhesion to a substrate. ##STR00001##

The present invention relates to compounds and methods useful as inhibitors of phosphodiesterase 4 (PDE4) for the treatment or prevention of inflammatory diseases and other diseases involving elevated levels of cytokines and proinflammatory mediators.

The present invention relates to compounds and methods useful as inhibitors of phosphodiesterase 4 (PDE4) for the treatment or prevention of inflammatory diseases and other diseases involving elevated levels of cytokines and proinflammatory mediators.

There is provided a compound of formula I, wherein R.sup.1, R.sup.2 R.sup.3, Q.sup.1, Q.sup.2 and Q.sup.3 are as defined herein, which compounds are useful in the treatment of diseases characterised by impaired signalling of neurotrophins and/or other trophic factors, such as Alzheimer's disease and the like.

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An isocyanate polymerization catalyst, a preparation method thereof and a method for preparing polyisocyanates comprising isocyanurate groups by using the same. The catalyst is a carboxylic acid salt containing a di-quaternary ammonium ion. The structure of the catalyst contains hydroxyl-containing aromatic heterocyclic residues. The catalyst is highly active. Only a small quantity of the catalyst is required for the polymerization of isocyanates. The prepared polyisocyanates have color values lower than 25 Hazen, monomer contents of less than 0.5% by weight, high contents of isocyanurates and low viscosities.

A resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1, and a solvent. A method of forming patterns uses the resist underlayer composition under a photoresist pattern to enhance the sensitivity of the photoresist to an exposure light source, thereby providing enhanced resolution and faster processing times.

##STR00001##

A composition is provided including a compound (A) represented by Formula (1) and a compound (B) represented by Formula (2), wherein the compound (B) is contained in an amount of 0.00002 to 0.2 parts by mass with respect to 100 parts by mass of the compound (A):

(R.sub.1—COO).sub.n—R.sub.2—(NCO).sub.m   (1)

(in Formula (1), R.sub.1 is an ethylenically unsaturated group having 2 to 7 carbon atoms; R.sub.2 is an (m+n)-valent hydrocarbon group having 1 to 7 carbon atoms; and n and m are each an integer of 1 or 2)

##STR00001##

(in Formula (2), R is (—R.sub.2—(OCO—R.sub.1), and R.sub.1 and R.sub.2 are the same as those in Formula (1)).

The present invention is a material for forming an organic film, including: a compound shown by the following general formula (1); and an organic solvent, where in the general formula (1), X represents an organic group with a valency of “n” having 2 to 50 carbon atoms or an oxygen atom, “n” represents an integer of 1 to 10, and R.sub.1 independently represents any of the following general formulae (2), where in the general formulae (2), broken lines represent attachment points to X, and Q.sub.1 represents a monovalent organic group containing a carbonyl group, at least a part of which is a group shown by the following general formulae (3), where in the general formulae (3), broken lines represent attachment points, X.sub.1 represents a single bond or a divalent organic group having 1 to 20 carbon atoms optionally having a substituent when the organic group has an aromatic ring, R.sub.2 represents a hydrogen atom, a methyl group, an ethyl group, or a phenyl group, and ** represents an attachment point. An object of the present invention is to provide a material for forming an organic film for forming an organic film having dry etching resistance, and also having high filling and planarizing properties and adhesion to a substrate.

##STR00001##