Patent classifications
C08F12/22
FORMAMIDE MONOMERS AND POLYMERS SYNTHESIZED THEREFROM
Formamide group-containing monomers and polymers made by polymerizing the monomers are provided. Also provided are methods of polymerizing the monomers and methods of synthesizing functionalized polymers by pre- and/or post-polymerization functionalization. The monomers are non-toxic and can generate highly reactive isocyanate and isonitrile precursors in a one-pot synthesis that enables the incorporation of complex functionalities into the side-chain of the polymers that are synthesized from the monomers.
Iodo-functionalized polymers as mass spectrometry calibrants with a mass-defect offset
The present invention discloses novel calibrants containing between 1 and 5 iodine atoms and methods of making them using linear polymers, hyperbranched polymers, and biological polymers (including but not limited to proteins and peptides.) Methods of using the calibrants are also disclosed, such as mass spectrometry. The novel calibrants disclosed herein have a more cost- and time-efficient synthesis than other calibrants.
Iodo-functionalized polymers as mass spectrometry calibrants with a mass-defect offset
The present invention discloses novel calibrants containing between 1 and 5 iodine atoms and methods of making them using linear polymers, hyperbranched polymers, and biological polymers (including but not limited to proteins and peptides.) Methods of using the calibrants are also disclosed, such as mass spectrometry. The novel calibrants disclosed herein have a more cost- and time-efficient synthesis than other calibrants.
AQUEOUS INK COMPOSITION, INK SET, IMAGE FORMING METHOD, AND RESIN MICROPARTICLES
An aqueous ink composition includes an aqueous medium and resin microparticles formed from a resin, in which the resin has a structural unit represented by General Formula (1) or (2), and the content of the resin microparticles is 1% to 15% by mass,
##STR00001## R.sup.1, R.sup.2, and R.sup.3 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; A.sup.1 represents —O— or —NR.sup.3—; L.sup.1 represents an alkylene group having 6 to 22 carbon atoms; M.sup.1 and M.sup.2 each represent a hydrogen atom, an alkali metal ion, or an ammonium ion; A.sup.2 represents a single bond, —COO—, or —CONH—; and L.sup.2 represents a divalent linking group having 6 to 23 carbon atoms.
POLYMER, MIXTURE AND COMPOUND CONTAINING SAME, AND ORGANIC ELECTRONIC DEVICE AND MONOMER THEREOF
Disclosed are a polymer, and a mixture or a formulation and an organic electronic device containing same, and applications thereof, and further a monomer of which the polymer is made; the polymer comprises on its side chain a repeating structure unit E, characterizing in that its (S1(E)−T1(E))≦0.35 eV or even less, which may allow the said polymer having thermally activated delayed fluorescence (TADF) property. Thus a TADF polymer suitable for printing processes is provided, thereby reducing OLED manufacturing costs.
POLYMER, NEGATIVE RESIST COMPOSITION, AND PATTERN FORMING PROCESS
A polymer comprising recurring units derived from vinylanthraquinone, recurring units containing a benzene ring having a hydroxyl-bearing tertiary alkyl group bonded thereto, and recurring units derived from hydroxystyrene is provided. The polymer is used as a base resin to formulate a negative resist composition having a high resolution and minimal LER.
PATTERN FORMING METHOD, RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
A pattern forming method includes the following steps (a) to (d): (a) applying an actinic ray-sensitive or radiation-sensitive resin composition including a resin capable of increasing a polarity by the action of an acid onto a substrate to form a resist film, (b) forming an upper layer film on the resist film, (c) exposing the resist film having the upper layer film formed thereon, and (d) developing the exposed resist film using an organic developer to form a pattern, in which the resin capable of increasing the polarity by the action of an acid includes an acid-decomposable repeating unit having an acid-leaving group a having 4 to 7 carbon atoms, and the maximum value of the number of carbon atoms and the protection rate of the acid-leaving group a satisfy specific conditions.
PATTERN FORMING METHOD, RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
A pattern forming method includes the following steps (a) to (d): (a) applying an actinic ray-sensitive or radiation-sensitive resin composition including a resin capable of increasing a polarity by the action of an acid onto a substrate to form a resist film, (b) forming an upper layer film on the resist film, (c) exposing the resist film having the upper layer film formed thereon, and (d) developing the exposed resist film using an organic developer to form a pattern, in which the resin capable of increasing the polarity by the action of an acid includes an acid-decomposable repeating unit having an acid-leaving group a having 4 to 7 carbon atoms, and the maximum value of the number of carbon atoms and the protection rate of the acid-leaving group a satisfy specific conditions.
POLYMER, POSITIVE RESIST COMPOSITION, AND PATTERN FORMING PROCESS
A polymer comprising recurring units derived from vinylanthraquinone, recurring units derived from acid labile group-substituted hydroxystyrene, and recurring units derived from hydroxystyrene is provided. The polymer is used as a base resin to formulate a positive resist composition having a high resolution and minimal LER.
Pattern formation method, active light-sensitive or radiation-sensitive resin composition, resist film, production method for electronic device using same, and electronic device
There are provided A pattern formation method, including: (1) forming a film using an active light-sensitive or radiation-sensitive resin composition; (2) exposing the film to active light or radiation; and (3) developing the exposed film using a developer including an organic solvent, wherein the active light-sensitive or radiation-sensitive resin composition contains a resin (A) having specific 3 repeating units.