A dielectric polymeric composition comprising a polymeric matrix comprising structural units derived from a polymerizable vinyl monomer; an ionic liquid comprising an organic cation and a balancing anion, wherein the ionic liquid is miscible or partially miscible with the polymerizable vinyl monomer, and wherein the concentration of ionic liquid in dielectric polymeric composition ranges from 0.5 to 30 wt. %; and less than 10 ppm of unreacted polymerizable vinyl monomer, based on the total weight of the composition, wherein an amount of unreacted polymerizable vinyl monomer in the composition is measured via HPLC. The polymeric matrix further comprises structural units derived from a polymerizable co-monomer comprising a functional group that has the ability to form hydrogen bonds within the polymeric matrix. The polymeric matrix further comprises a crosslinking agent, and wherein the polymeric matrix comprises covalent crosslinks between the crosslinking agent and the structural units derived from the polymerizable vinyl monomer.

A dielectric polymeric composition comprising a polymeric matrix comprising structural units derived from a polymerizable vinyl monomer; an ionic liquid comprising an organic cation and a balancing anion, wherein the ionic liquid is miscible or partially miscible with the polymerizable vinyl monomer, and wherein the concentration of ionic liquid in dielectric polymeric composition ranges from 0.5 to 30 wt. %; and less than 10 ppm of unreacted polymerizable vinyl monomer, based on the total weight of the composition, wherein an amount of unreacted polymerizable vinyl monomer in the composition is measured via HPLC. The polymeric matrix further comprises structural units derived from a polymerizable co-monomer comprising a functional group that has the ability to form hydrogen bonds within the polymeric matrix. The polymeric matrix further comprises a crosslinking agent, and wherein the polymeric matrix comprises covalent crosslinks between the crosslinking agent and the structural units derived from the polymerizable vinyl monomer.

The invention provides (meth)acrylic oligomers prepared from C1-C20 alkyl and C5-C20 cycloalkyl (meth)acrylates, wherein said oligomers have a Mn of about 300 g/mole to about 3,000 g/mole; a Mw of about 700 g/mole to about 6,000 g/mole; a Mz of about 900 g/mole to about 10,000 g/mole. The oligomers may have a Yellowness Index, according to ASTM E313 of less than 2. The oligomers of the invention are useful as tackifiers in adhesive compositions, but also are believed to be useful also in general polymer modification as plasticizers, leveling agents, viscosity reducers (i.e., rheology modifiers), and for increasing solids content in solvent-borne applications of all types with little detrimental impact on viscosity. The invention also provides adhesive compositions and laminate articles coated on at least one side with the adhesive compositions of the invention.

Particles of an acrylic polymer comprising a constituent unit (A) derived from methyl methacrylate and a constituent unit (B) derived from a (meth)acrylic acid alkyl ester in which the alkyl group has 2 to 8 carbon atoms, wherein the particles having electrostatic buildup inhibition rate of 90 to 99.9° as obtained by a specific method.

Particles of an acrylic polymer comprising a constituent unit (A) derived from methyl methacrylate and a constituent unit (B) derived from a (meth)acrylic acid alkyl ester in which the alkyl group has 2 to 8 carbon atoms, wherein the particles having electrostatic buildup inhibition rate of 90 to 99.9° as obtained by a specific method.

An ink composition includes an acrylic resin including a polymerization product of a first monomer having a hydroxyl group, a second monomer having an epoxy group, a third monomer having an acrylate group, and a fourth monomer having a substituted or unsubstituted phenyl group, a first curing agent having an isocyanate group, and a second curing agent having an amine group. Durability and abrasion resistance of a window may be improved.

An ink composition includes an acrylic resin including a polymerization product of a first monomer having a hydroxyl group, a second monomer having an epoxy group, a third monomer having an acrylate group, and a fourth monomer having a substituted or unsubstituted phenyl group, a first curing agent having an isocyanate group, and a second curing agent having an amine group. Durability and abrasion resistance of a window may be improved.

Disclosed is a composition comprising a polycarbonate or engineering resin and a branched polymer which is a reaction product of reactants comprising one or more monoethylenically unsaturated ester monomers, a chain transfer agent in an amount of 0.1 to 10 weight percent, and a crosslinker in an amount of 0.1 to 10 weight percent of a crosslinker, wherein weight percent is based on total amount of reactants, provided the amount of crosslinker in moles is less than the effective amount of chain transfer agent in moles, and articles thereof.

Disclosed is a composition comprising a polycarbonate or engineering resin and a branched polymer which is a reaction product of reactants comprising one or more monoethylenically unsaturated ester monomers, a chain transfer agent in an amount of 0.1 to 10 weight percent, and a crosslinker in an amount of 0.1 to 10 weight percent of a crosslinker, wherein weight percent is based on total amount of reactants, provided the amount of crosslinker in moles is less than the effective amount of chain transfer agent in moles, and articles thereof.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.