The present invention is directed to an acrylic polymer prepared from a reaction mixture comprising: (i) an ethylenically unsaturated monomer comprising hydroxyl functional groups; (ii) an ethylenically unsaturated monomer comprising polydialkylsiloxane groups; (iii) an ethylenically unsaturated monomer comprising carboxylic acid functional groups or amine functional groups; and (iv) a reactive diluent that is reactive with the ethylenically unsaturated monomer (iii). The reactive diluent (iv) is present initially in the reaction mixture as a medium in which the monomers polymerize. The present invention is further directed to aqueous polymeric dispersions prepared therefrom and aqueous, curable film-forming compositions prepared from the dispersions. The curable film-forming compositions are low VOC and are useful in methods of mitigating dirt build-up on a substrate.

The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.08 part by mass or less: Component (A): a compound having either or both of a hydroxyl group and a carboxyl group and a polymerizable unsaturated group, Component (B): an aromatic vinyl compound, Component (C): a reinforcing fiber bundle having a fiber length of 5 mm or more and 120 mm or less, Component (D): an isocyanate compound, and Component (E): a metal chelate compound.

The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.08 part by mass or less: Component (A): a compound having either or both of a hydroxyl group and a carboxyl group and a polymerizable unsaturated group, Component (B): an aromatic vinyl compound, Component (C): a reinforcing fiber bundle having a fiber length of 5 mm or more and 120 mm or less, Component (D): an isocyanate compound, and Component (E): a metal chelate compound.

A film touch sensor includes a separation layer; a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer that is a cured layer of a binder resin including (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) an acrylic resin containing an oxetane group, such that it is possible to suppress thermal damage such as wrinkles, or cracks of the insulation layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.

An ink composition includes an acrylic resin including a polymerization product of a first monomer having a hydroxyl group, a second monomer having an epoxy group, a third monomer having an acrylate group, and a fourth monomer having a substituted or unsubstituted phenyl group, a first curing agent having an isocyanate group, and a second curing agent having an amine group. Durability and abrasion resistance of a window may be improved.

An ink composition includes an acrylic resin including a polymerization product of a first monomer having a hydroxyl group, a second monomer having an epoxy group, a third monomer having an acrylate group, and a fourth monomer having a substituted or unsubstituted phenyl group, a first curing agent having an isocyanate group, and a second curing agent having an amine group. Durability and abrasion resistance of a window may be improved.

Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.

Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.

A preparation method of vinyl ester resin for optimizing heat-release during curing includes: (A) providing a vinyl ester, a solvent and a phase change material to perform mixture; (B) performing a heating process to remove the solvent, so as to obtain a vinyl ester resin containing the phase change material. Thereby, the organic PCM material with high heat absorption and good resin affinity can be used as the temperature control agent of the vinyl ester resin during the curing process for avoiding the defects such as bubbles and cracks being generated in the vinyl ester resin.

A photosensitive resin composition, an optical film, and a method of producing an optical film are provided. The photosensitive resin composition includes an ethylenically unsaturated group-containing compound (A) having one or two aromatic rings; a bisphenol fluorene oligomer (B) having one or two (meth)acryloyl groups; and a photoinitiator (C), wherein the weight ratio of the ethylenically unsaturated group-containing compound (A) to the bisphenol fluorene oligomer (B) is from 0.50 to 0.95.