Aspects generally relate to a temperature responsive polymer, more specifically to a polymer exhibiting an upper critical solution temperature (UCST) in an aqueous solution. In one aspect, a monomer compound includes one or more amide or thioamide groups; one or more ureido or thioureido groups; and one or more ethylenically unsaturated groups. In one aspect, a polymer, such as a homopolymer or a copolymer, is produced by polymerization of the monomer compound. The copolymer is produced by polymerization of the monomer compound and a comonomer, such as a hydrophobic comonomer, a hydrophilic comonomer, a pH responsive comonomer, a light responsive comonomer, and combinations thereof. The polymer exhibits a UCST from about 1° C. to about 100° C. in an aqueous solution at 1 atm.

A composite oligomeric material includes one or more repeating backbone units; one or more polarizable units incorporated into or connected to one or more of the one or more repeating backbone units; and one or more resistive tails connected to one or more of the repeating backbone units or to the one or more polarizable units as a side chain on the polarizable unit, on a handle linking a polarizable unit to a backbone unit, or directly attached to a backbone unit. The composite oligomer material may be polymerized to form a metadielectric, which may be sandwiched between to electrodes to form a metacapacitor.

A composite oligomeric material includes one or more repeating backbone units; one or more polarizable units incorporated into or connected to one or more of the one or more repeating backbone units; and one or more resistive tails connected to one or more of the repeating backbone units or to the one or more polarizable units as a side chain on the polarizable unit, on a handle linking a polarizable unit to a backbone unit, or directly attached to a backbone unit. The composite oligomer material may be polymerized to form a metadielectric, which may be sandwiched between to electrodes to form a metacapacitor.

Described herein are water-soluble UV-absorbing vinylic monomers and their uses in preparing UV-absorbing contact lenses capable of blocking ultra-violet (“UV”) radiation and optionally (but preferably) violet radiation with wavelengths from 380 nm to 440 nm, thereby protecting eyes to some extent from damages caused by UV radiation and potentially from violet radiation. This invention also provides a UV-absorbing contact lens.

Provided are a photocurable resin composition and fabrication method of window member using the same. The photocurable resin composition includes a (meth)acrylic resin, a urethane acrylate oligomer, a photopolymerizable monomer and a photopolymerization initiator. Accordingly, deterioration in physical properties such as cracking or decrease of adhesion under additional ultraviolet irradiation conditions, high temperature and high humidity conditions, and thermal shock conditions does not occur.

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]

The invention provides UV-sensitive monomers, comprising a cyclopropenone-containing group, which acts as a masked dibenzocyclooctyne (DBCO)/dibenzoazocyclooctyne (DIBAC) group. The monomers of the invention can be polymerized for example via reversible addition fragmentation chain transfer (RAFT) polymerization techniques to yield a polymer comprising the masked DBCO/DIBAC group. In certain embodiments, the DBCO/DIBAC group can be unmasked under controlled conditions, allowing conjugation of small molecules and/or macromolecules to the polymer through highly selective and efficient strain-promoted azide alkyne click chemistry (SPAAC).

The invention provides UV-sensitive monomers, comprising a cyclopropenone-containing group, which acts as a masked dibenzocyclooctyne (DBCO)/dibenzoazocyclooctyne (DIBAC) group. The monomers of the invention can be polymerized for example via reversible addition fragmentation chain transfer (RAFT) polymerization techniques to yield a polymer comprising the masked DBCO/DIBAC group. In certain embodiments, the DBCO/DIBAC group can be unmasked under controlled conditions, allowing conjugation of small molecules and/or macromolecules to the polymer through highly selective and efficient strain-promoted azide alkyne click chemistry (SPAAC).

A resist underlayer film-forming composition for lithography capable of being dry-etched during pattern transfer from the upper layer or during substrate processing and capable of being removed with an alkaline aqueous solution after the substrate processing. The composition includes a polymer (A) having an acrylamide structure or an acrylic acid ester structure; a polymer (B) having a blocked isocyanate structure; and a solvent (C). The polymer (A) is a polymer including a unit structure of Formula (1). The polymer (B) is a polymer including a unit structure of Formula (2). A method for manufacturing a semiconductor device includes steps for: forming a resist pattern; etching an inorganic hard mask layer with use of the resist pattern; etching a resist underlayer film with use of the pattered inorganic hard mask layer; and processing a semiconductor substrate with use of the pattered resist underlayer film. ##STR00001##