Patent classifications
C08F220/14
UV cure basecoatings for medical devices
The invention concerns coating composition comprising hydrophobic polymer for use as a photoreactive basecoat for a medical device or implant comprising a polymer made from monomers comprising: (a) 1 to 12 mol % of at least one photoactive monomer that is a hydrogen atom abstracter and (b) 99 to 88 mol % of one or more of acrylamides, methacrylamides, acrylates, methacrylates, and N-vinylpyrrolidone; wherein the polymer has a glass transition temperature (Tg) of less than 40° C.
UV cure basecoatings for medical devices
The invention concerns coating composition comprising hydrophobic polymer for use as a photoreactive basecoat for a medical device or implant comprising a polymer made from monomers comprising: (a) 1 to 12 mol % of at least one photoactive monomer that is a hydrogen atom abstracter and (b) 99 to 88 mol % of one or more of acrylamides, methacrylamides, acrylates, methacrylates, and N-vinylpyrrolidone; wherein the polymer has a glass transition temperature (Tg) of less than 40° C.
Composition
Provided is a molded body having excellent heat resistance. A composition containing methyl methacrylate, methyl isobutyrate and methyl acrylate, in which a content of methyl methacrylate is 99.5% by mass or more, a concentration of methyl isobutyrate is 20 ppm by mass to 300 ppm by mass, and a concentration of methyl acrylate is 5 ppm by mass to 200 ppm by mass.
Composition
Provided is a molded body having excellent heat resistance. A composition containing methyl methacrylate, methyl isobutyrate and methyl acrylate, in which a content of methyl methacrylate is 99.5% by mass or more, a concentration of methyl isobutyrate is 20 ppm by mass to 300 ppm by mass, and a concentration of methyl acrylate is 5 ppm by mass to 200 ppm by mass.
Air void control composition for carbonyl-containing monomer polymerization
The invention relates to the use of low levels of glycols and short chain diols to control air void formation in any polymerization reaction having carbonyl-containing monomers, and preferably carboxylic acid ester monomers, at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The glycols and short chain diols are used in the polymization mixture at levels of 0.5 to 10 weight percent, based on the carboxylic acid ester-containing monomer. It is believed the glycols and short chain diols hydrogen bond with the —(C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methyl methacrylate polymers and copolymers, either neat, or as a polymer composite system.
Air void control composition for carbonyl-containing monomer polymerization
The invention relates to the use of low levels of glycols and short chain diols to control air void formation in any polymerization reaction having carbonyl-containing monomers, and preferably carboxylic acid ester monomers, at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The glycols and short chain diols are used in the polymization mixture at levels of 0.5 to 10 weight percent, based on the carboxylic acid ester-containing monomer. It is believed the glycols and short chain diols hydrogen bond with the —(C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methyl methacrylate polymers and copolymers, either neat, or as a polymer composite system.
Air void control composition for carbonyl-containing monomer polymerization
The invention relates to the use of low levels of glycols and short chain diols to control air void formation in any polymerization reaction having carbonyl-containing monomers, and preferably carboxylic acid ester monomers, at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The glycols and short chain diols are used in the polymization mixture at levels of 0.5 to 10 weight percent, based on the carboxylic acid ester-containing monomer. It is believed the glycols and short chain diols hydrogen bond with the —(C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methyl methacrylate polymers and copolymers, either neat, or as a polymer composite system.
Multicolor dispersion and multicolor coating composition formed therefrom
A multicolor dispersion comprising a protective composition and two or more colorant dispersions, wherein the protective composition comprises (1) an aqueous dispersion of polymer particles comprising from 89% to 99.45% by weight, based on the total dry weight of the protective composition, of polymer particles, wherein said aqueous dispersion of polymer particles further comprises from 0.33% to 2% by weight, based on the total dry weight of the polymer, of an anionic stabilizer monomer represented by the following Formula I, ##STR00001##
wherein R.sub.1 is a linkage group between R.sub.2 and a vinyl group, R.sub.2 is ethylene or propene or butylene, n is from 0 to 50, M is a counter salt of potassium, sodium, ammonium or lithium; wherein said aqueous dispersion of polymer particles further comprises from 0.33% to 5% by weight, based on the total dry weight of the polymer, of a non-reactive anionic surfactant having an ethylene oxide chain length of less than 11; and (2) from 0.5% to 10% by weight, based on the total dry weight of the protective composition, of a clay.
Multicolor dispersion and multicolor coating composition formed therefrom
A multicolor dispersion comprising a protective composition and two or more colorant dispersions, wherein the protective composition comprises (1) an aqueous dispersion of polymer particles comprising from 89% to 99.45% by weight, based on the total dry weight of the protective composition, of polymer particles, wherein said aqueous dispersion of polymer particles further comprises from 0.33% to 2% by weight, based on the total dry weight of the polymer, of an anionic stabilizer monomer represented by the following Formula I, ##STR00001##
wherein R.sub.1 is a linkage group between R.sub.2 and a vinyl group, R.sub.2 is ethylene or propene or butylene, n is from 0 to 50, M is a counter salt of potassium, sodium, ammonium or lithium; wherein said aqueous dispersion of polymer particles further comprises from 0.33% to 5% by weight, based on the total dry weight of the polymer, of a non-reactive anionic surfactant having an ethylene oxide chain length of less than 11; and (2) from 0.5% to 10% by weight, based on the total dry weight of the protective composition, of a clay.
Ammonia-based, imide-containing resin cuts of styrene-maleic resins
A process of preparing an aqueous solution of a cycloimide-containing polymer includes heating an aqueous solution of a cycloanhydride-containing polymer with a first neutralizing agent at a ratio of cycloanhydride to neutralizing agent of about 1:1 to about 1:1.5 at a temperature and for a time sufficient to form the aqueous solution of the cycloimide-containing polymer having a cycloimide to acid group ratio of about 1:2 to about 1.5:2.