Provided are a photocurable composition capable of suppressing both deformation (change in line width roughness (LWR)) of a pattern after etching and breakage of a pattern after etching, a pattern forming method, and a method for manufacturing a device. Disclosed is a photocurable composition including a monofunctional (meth)acrylate represented by the following General Formula (I) and a photopolymerization initiator, where R.sup.1 represents a hydrogen atom or a methyl group; R.sup.2 represents an alkyl group which may be substituted with a fluorine atom, R.sup.3 represents a hydrogen atom, a linear alkyl group which may be substituted with a fluorine atom, or a branched alkyl group which may be substituted with a fluorine atom, R.sup.4 to R.sup.8 each independently represent a hydrogen atom, a halogen atom, a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 or 4 carbon atoms, the total number of carbon atoms included in R.sup.2 and R.sup.3 is 1 to 6, and R.sup.2 and R.sup.3, or R.sup.2 and R.sup.4 may be bonded to each other and form a ring.

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The present disclosure provides a resin composition comprising: a component (A): 100 parts by weight of polyphenylene ether resin containing unsaturated carbon-carbon double bonds; a component (B): 1 to 20 parts by weight of unhydrogenated maleic anhydride-modified first polyolefin; and a component (C): 5 to 100 parts by weight of benzocyclobutene-modified second polyolefin. Besides, the present disclosure also provides an article made from the resin composition. The article comprises a prepreg, a resin film, a laminate or a printed circuit board that has improvements in one or more properties including stability of peeling strength of bonding sheet and core, solder ball shear, bonding gap and solder floating delamination rate.

The present disclosure provides a resin composition comprising: a component (A): 100 parts by weight of polyphenylene ether resin containing unsaturated carbon-carbon double bonds; a component (B): 1 to 20 parts by weight of unhydrogenated maleic anhydride-modified first polyolefin; and a component (C): 5 to 100 parts by weight of benzocyclobutene-modified second polyolefin. Besides, the present disclosure also provides an article made from the resin composition. The article comprises a prepreg, a resin film, a laminate or a printed circuit board that has improvements in one or more properties including stability of peeling strength of bonding sheet and core, solder ball shear, bonding gap and solder floating delamination rate.