An object of the present invention is to provide a resist underlayer film forming composition for lithography that has features of having excellent smoothing performance on an uneven substrate, good embedding performance into a fine hole pattern, and a smoothed wafer surface after film formation, and the like. The object can be achieved by an underlayer film forming composition for lithography containing a compound having a protecting group.

A composition for forming a resist underlayer film includes: a solvent; and a polymer containing a unit structure (A) represented by formula (1). The composition is reduced in the amount of sublimated substances that contaminate a device, is improved in the in-plane uniform coatability of a film to be coated thereon, exhibits satisfactory resistance to a chemical solution used in a resist under layer film, and can exhibit other satisfactory properties.

A method for preparing dispersant using lignin degradation products includes preparation of lignin degradation products: degrading lignin which are used as raw materials using alkali through microwave-assisted activation at the presence of a metal oxide catalyst to obtain the lignin degradation products; and preparation of dispersant: preparing dispersant by molecularly reforming and chemically modifying the lignin degradation products obtained in the step of preparation of lignin degradation products.

A method for preparing dispersant using lignin degradation products includes preparation of lignin degradation products: degrading lignin which are used as raw materials using alkali through microwave-assisted activation at the presence of a metal oxide catalyst to obtain the lignin degradation products; and preparation of dispersant: preparing dispersant by molecularly reforming and chemically modifying the lignin degradation products obtained in the step of preparation of lignin degradation products.

A material to form a resist underlayer film having properties achieving heat resistance, flattening properties, and etching resistance through lithography. A resist underlayer film forming composition including a polymer having a unit structure of Formula (1): ##STR00001##
(wherein R.sup.1 is an organic group having at least two amines and at least three C.sub.6-40 aromatic rings, R.sup.2 and R.sup.3 are each a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-40 aryl group, a heterocyclic group, or a combination thereof, and the alkyl group, the aryl group, and the heterocyclic group are optionally substituted with a halogen group, a nitro group, an amino group, a formyl group, an alkoxy group, or a hydroxy group, or R.sup.2 and R.sup.3 optionally form a ring together). The above mentioned composition t, wherein R.sup.1 is a divalent organic group derived from N,N′-diphenyl-1,4-phenylenediamine.

A material to form a resist underlayer film having properties achieving heat resistance, flattening properties, and etching resistance through lithography. A resist underlayer film forming composition including a polymer having a unit structure of Formula (1): ##STR00001##
(wherein R.sup.1 is an organic group having at least two amines and at least three C.sub.6-40 aromatic rings, R.sup.2 and R.sup.3 are each a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-40 aryl group, a heterocyclic group, or a combination thereof, and the alkyl group, the aryl group, and the heterocyclic group are optionally substituted with a halogen group, a nitro group, an amino group, a formyl group, an alkoxy group, or a hydroxy group, or R.sup.2 and R.sup.3 optionally form a ring together). The above mentioned composition t, wherein R.sup.1 is a divalent organic group derived from N,N′-diphenyl-1,4-phenylenediamine.

This disclosure describes new compositions and methods related to photoresponsive poly(hexahydrotriazines) and related polymers. In an embodiment, a method of patterning a substrate includes forming a liquid poly(hemiaminal) material by a process that includes forming a reaction mixture comprising a polar solvent, paraformaldehyde, and an aminobenzene compound having photoreactive groups, and heating the reaction mixture at a temperature up to 50° C. The method further includes applying the liquid poly(hemiaminal) material to a substrate; patterning the liquid poly(hemiaminal) material with UV light; and curing the liquid poly(hemiaminal) material to form a cured poly(hexahydrotriazine) polymer.

This disclosure describes new compositions and methods related to photoresponsive poly(hexahydrotriazines) and related polymers. In an embodiment, a method of patterning a substrate includes forming a liquid poly(hemiaminal) material by a process that includes forming a reaction mixture comprising a polar solvent, paraformaldehyde, and an aminobenzene compound having photoreactive groups, and heating the reaction mixture at a temperature up to 50° C. The method further includes applying the liquid poly(hemiaminal) material to a substrate; patterning the liquid poly(hemiaminal) material with UV light; and curing the liquid poly(hemiaminal) material to form a cured poly(hexahydrotriazine) polymer.

A method to make heteroatom doped polymer nanosphere/carbon nanospheres uses aromatic amine and aldehyde as raw materials, and in the presence of a compound represented by formula I, reacts the aldehyde with the compound represented by formula Ito form a Schiff base, and then reacts the aromatic amine with the resulting Schiff base, wherein the reaction is conducted in an aqueous solution system at a mild reaction temperature (10° C. to 50° C.) under stirring. The resulting polymer nanospheres are subject to centrifugation and drying, followed by roasting in an inert atmosphere to obtain carbon nanospheres. The nanospheres product prepared using the method has controllable dimensions and morphology, an even particle size, and homogeneously doped heteroatoms.

Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.