The invention provides: a composition for forming an organic film, the composition having high filterability and enabling formation of an organic film which has high pattern-curving resistance, and which prevents a high-aspect line pattern particularly finer than 40 nm from line collapse and twisting after dry etching; a method for forming an organic film and a patterning process which use the composition; and a substrate for manufacturing a semiconductor device, including the organic film formed on the substrate. The composition for forming an organic film includes a condensate (A), which is a condensation product of dihydroxynaphthalene shown by the following formula (1) and a condensation agent, or a derivative of the condensate (A). A sulfur content among constituent elements contained in the condensate (A) or the derivative of the condensate (A) is 100 ppm or less in terms of mass. ##STR00001##

The present invention provides a compound having a specific structure represented by the following formula (0), a resin having a constituent unit derived from the compound, various compositions containing the compound and/or the resin, and various methods using the compositions.

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The present invention provides a composition for resist underlayer film formation comprising a tellurium-containing compound or a tellurium-containing resin.

An admixture for a hydraulic composition includes a polycondensation product P containing a copolymer prepared by polycondensation of a monomer mixture containing compounds A to C of the following Formulae (A) to (C); and a polycarboxylic acid-based polymer Q including a structural unit having an amino and an imino group, and/or a structural unit having an amino, imino, and amido group:

##STR00001## (wherein R.sub.1 is a hydrogen atom, alkyl, or alkenyl group; A.sub.1O is a C.sub.2-4 alkylene oxide group; p is a number of 1 to 300; and X is a hydrogen atom, an alkyl, or acyl group; R.sub.2 is an alkyl or alkenyl group; A.sub.2O is a C.sub.2-4 alkylene oxide group; q is a number of 1 to 300; and Y.sub.1 is a phosphate ester group; and R.sub.3 is a hydrogen atom, carboxy, alkyl, alkenyl, phenyl, naphthyl, or heterocyclic group; and r is a number of 1 to 100).

In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece. A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other. ##STR00001##

The invention provides: a composition for forming an organic film, the composition having high filterability and enabling formation of an organic film which has high pattern-curving resistance, and which prevents a high-aspect line pattern particularly finer than 40 nm from line collapse and twisting after dry etching; a method for forming an organic film and a patterning process which use the composition; and a substrate for manufacturing a semiconductor device, including the organic film formed on the substrate. The composition for forming an organic film includes a condensate (A), which is a condensation product of dihydroxynaphthalene shown by the following formula (1) and a condensation agent, or a derivative of the condensate (A). A sulfur content among constituent elements contained in the condensate (A) or the derivative of the condensate (A) is 100 ppm or less in terms of mass.

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A method for producing a binder composition without using a compound selected from the class of phenols, is disclosed. The method comprises: (i) heating an aqueous composition comprising lignin and lignin oligomer in the presence of a catalyst at a temperature of 50-95? ? C. for 0.25-5 hours; (ii) mixing a cross-linking agent with the aqueous composition from (i) and heating the same at a temperature of 60-95? C. for polymerizing lignin, lignin oligomers, and cross-linking agent until a binder composition with a predetermined viscosity value is formed; wherein the molar ratio of crosslinking agent to lignin and lignin oligomer is 0.5-1.8.

In the phenolic resin to be blended with rubber of the present invention, when the total peak area in a chemical shift measured by .sup.13C-NMR of 110 ppm or more and 160 ppm or less is taken as 100, the total peak area in 0 ppm or more and less than 60 ppm is 80 to 400 and the total peak area in 60 ppm or more and less than 110 ppm is 2 to 70.

The formaldehyde-free binder for materials containing cellulose contains a hydroxy aldehyde resin polycondensed with an ammonium salt, the resin being obtained, in especially preferred embodiments, from glycerin, in situ, with the aid of hydrogen peroxide. A protein component consisting of animal blood is added. The binder is urea-free and can be used as a one-component or two-component binder. It binds materials such as wood, paper and other natural fibres to form high-quality composite material products.

In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.

A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.

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