Patent classifications
C08G16/0225
Charge-transporting varnish
Provided is a charge-transporting varnish which includes a charge-transporting material including fluorine atoms, a charge-transporting material not including fluorine atoms, a dopant material comprising heteropoly acid, and an organic solvent, said charge-transporting material including fluorine atoms being a polymer of weight-average 1,000 to 200,000 molecular weight obtained by condensing a triarylamine compound, an aryl aldehyde compound including fluorine atoms, and a fluorine derivative having a carbonyl group, and said charge-transporting material not including fluorine atoms being an oligoaniline compound. The charge-transporting varnish provides a thin film which, even in a case of being used as a single layer in contact with and in between an anode and a luminescent layer, is capable of achieving an organic EL element having superior luminance characteristics and durability.
Functionalized ketone-aldehyde condensation resins
A functionalized ketone-aldehyde condensation resin is produced by condensing a ketone and an aldehyde in the presence of at least one alcohol or alkoxylate thereof, wherein the alcohol comprises amino alcohols and derivatives thereof, hydroxybutyl vinyl ether, OH-functional acrylates, OH-functional terpenes, OH-functional halogen compounds, hydroxycarboxylic acids, sulphur-containing alcohols, hydroxyl-containing urea derivatives, carbohydrates, siloxanes, OH-functional phosphorus compounds or unsaturated alcohols.
Methods for making wet gels and dried gels therefrom
Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can include a carboxylic acid, an anhydride, a homopolymer, a copolymer, or any mixture thereof. At least the hydroxybenzene compound and the aldehyde compound can be reacted to produce a wet gel. The reaction mixture can include about 10 wt % to about 65 wt % of the hydroxybenzene compound, about 5 wt % to about 25 wt % of the aldehyde compound, up to about 85 wt % of the carboxylic acid, up to about 40 wt % of the anhydride, up to about 40 wt % of the homopolymer, and up to about 40 wt % of the copolymer, where weight percent values are based on the combined weight of the hydroxybenzene compound, the aldehyde compound, and the additive.
METHODS FOR MAKING WET GELS AND DRIED GELS THEREFROM
Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can include a carboxylic acid, an anhydride, a homopolymer, a copolymer, or any mixture thereof. At least the hydroxybenzene compound and the aldehyde compound can be reacted to produce a wet gel. The reaction mixture can include about 10 wt % to about 65 wt % of the hydroxybenzene compound, about 5 wt % to about 25 wt % of the aldehyde compound, up to about 85 wt % of the carboxylic acid, up to about 40 wt % of the anhydride, up to about 40 wt % of the homopolymer, and up to about 40 wt % of the copolymer, where weight percent values are based on the combined weight of the hydroxybenzene compound, the aldehyde compound, and the additive.
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R.sub.1 to R.sub.7, m.sub.1 to m.sub.4, n.sub.1, n.sub.2, Y and W are each as defined in the description.
##STR00001##
Methods for making wet gels and dried gels therefrom
Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can include a carboxylic acid, an anhydride, a homopolymer, a copolymer, or any mixture thereof. At least the hydroxybenzene compound and the aldehyde compound can be reacted to produce a wet gel. The reaction mixture can include about 10 wt % to about 65 wt % of the hydroxybenzene compound, about 5 wt % to about 25 wt % of the aldehyde compound, up to about 85 wt % of the carboxylic acid, up to about 40 wt % of the anhydride, up to about 40 wt % of the homopolymer, and up to about 40 wt % of the copolymer, where weight percent values are based on the combined weight of the hydroxybenzene compound, the aldehyde compound, and the additive.
Crosslinkable composition, a method of making the same and a crosslinked composition produced therefrom
A crosslinkable composition comprising: (i) one or more polycarbamates; (ii) one or more polyaldehydes; (iii) one or more polyols; and (iv) an acid catalyst is provided. Further provided are a method for making the crosslinkable composition, a crosslinked composition made therefrom, a coating comprising the crosslinked composition and articles comprising a substrate and the coating.
Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device
Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R.sub.1 to R.sub.7, m.sub.1 to m.sub.4, n.sub.1, n.sub.2, Y and W are each as defined in the description. ##STR00001##
Aromatic hydrocarbon formaldehyde resin, modified aromatic hydrocarbon formaldehyde resin and epoxy resin, and methods for producing these
There is provided an aromatic hydrocarbon formaldehyde resin obtained by reacting an aromatic hydrocarbon compound (A) represented by the following formula (1) with formaldehyde (B) in the presence of an acidic catalyst. ##STR00001##
wherein R represents an organic group having 1 to 10 carbon atoms; m and n represent integers satisfying 1m+n10, m0 and n1.
PROCESS FOR THE PREPARATION OF A BONDING RESIN
The present invention relates to a bonding resin useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiber-boards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications. The invention also relates to a method for preparing the bonding resin. The bonding resin comprises hydroxymethylfurfural, furfural, furfuryl alcohol, acetoxymethyl furfural or oligomer of hydroxymethylfurfural or a combination thereof and one or more crosslinker and optionally one or more additives.