Patent classifications
C08G18/69
Polyurethane adhesives for reverse osmosis modules
An adhesive composition suitable for reverse osmosis modules, the adhesive composition includes (I) a polyurethane composition that includes (A) an isocyanate group-containing pre-polymer comprising a reaction product of (i) castor oil or a derivative thereof; and (ii) a polyisocyanate; and (iii) optionally a second polyol; and (B) an isocyanate-reactive polyol mixture comprising: (i) a polybutadiene polyol; and (ii) a urethane catalyst; and (iii) optionally the second polyol; and (II) a plasticizer wherein the adhesive composition is essentially free from diluent oils and solvents.
Article with reactive metals bound to its surface and method of application
A polymeric carrier composition including a polymer synthesized from monomers selected from acrylic acids, methylacrylates and urethanes and at least one metal having an oxidation state of +1 or +2, including salts and coordination complexes thereof. The composition may be a suspension having 0.5 to 10% by weight of the polymer prepared from monomers selected from a group consisting of acrylic acids, methylacrylates and urethanes, and a viscosity less than 1,000 cps. The composition is applied to substrates, such as woven fabrics, to create metal-infused articles.
Article with reactive metals bound to its surface and method of application
A polymeric carrier composition including a polymer synthesized from monomers selected from acrylic acids, methylacrylates and urethanes and at least one metal having an oxidation state of +1 or +2, including salts and coordination complexes thereof. The composition may be a suspension having 0.5 to 10% by weight of the polymer prepared from monomers selected from a group consisting of acrylic acids, methylacrylates and urethanes, and a viscosity less than 1,000 cps. The composition is applied to substrates, such as woven fabrics, to create metal-infused articles.
Thermally vulcanisable adhesive and adhesive strip produced therefrom
Thermally vulcanisable, meltable adhesives and processes have a meltable polybutadiene-polyurethane, ground sulphur and optionally at least one vulcanisation accelerator, at least one filling material, at least one epoxide resin, at least one tackifier resin, bitumen, at least one softener and further auxiliary and additive materials, wherein said adhesives and processes can be thermally vulcanised within a temperature range of 130° C. to 230° C., such that same, as well as an adhesive strip produced from same, can be used for adhesion and/or sealing in the automotive industry, as well as in structural work on oiled sheet metal, and in the painting line on e-coated or otherwise painted sheet metal, for example, for crimp fold adhesion, for crimp fold sealing, for seam sealing, for lining adhesion, for hole closure and much more.
Thermally vulcanisable adhesive and adhesive strip produced therefrom
Thermally vulcanisable, meltable adhesives and processes have a meltable polybutadiene-polyurethane, ground sulphur and optionally at least one vulcanisation accelerator, at least one filling material, at least one epoxide resin, at least one tackifier resin, bitumen, at least one softener and further auxiliary and additive materials, wherein said adhesives and processes can be thermally vulcanised within a temperature range of 130° C. to 230° C., such that same, as well as an adhesive strip produced from same, can be used for adhesion and/or sealing in the automotive industry, as well as in structural work on oiled sheet metal, and in the painting line on e-coated or otherwise painted sheet metal, for example, for crimp fold adhesion, for crimp fold sealing, for seam sealing, for lining adhesion, for hole closure and much more.
Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
PHOTOCURABLE (METH)ACRYLATE COMPOSITIONS
Photocurable (meth)acrylate compositions for forming features on the surfaces of membranes, and particularly, on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.
PHOTOCURABLE (METH)ACRYLATE COMPOSITIONS
Photocurable (meth)acrylate compositions for forming features on the surfaces of membranes, and particularly, on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.
RESIN COMPOSITION AND DISPLAY DEVICE INCLUDING ADHESIVE LAYER FORMED FROM THE SAME
Provided is a resin composition including at least one (meth)acrylate monomer, a urethane (meth)acrylate oligomer, and at least one photo initiator. The urethane (meth)acrylate oligomer includes a phosphate ester group and is represented by Formula 1. Accordingly, the resin composition may exhibit satisfactory compatibility before curing and may exhibit excellent adhesion after curing.
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RESIN COMPOSITION AND DISPLAY DEVICE INCLUDING ADHESIVE LAYER FORMED FROM THE SAME
Provided is a resin composition including at least one (meth)acrylate monomer, a urethane (meth)acrylate oligomer, and at least one photo initiator. The urethane (meth)acrylate oligomer includes a phosphate ester group and is represented by Formula 1. Accordingly, the resin composition may exhibit satisfactory compatibility before curing and may exhibit excellent adhesion after curing.
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