Patent classifications
C08G18/69
SYSTEM FOR PRODUCING A SEALING COMPOUND FOR INSULATING GLASS
The present invention relates to a system for the production of a sealant composite made of a primary sealing material and a curable secondary sealing material, the use of the system for the production of insulating glass or solar modules, an edge seal for the production of double-pane or multi-pane insulating glass or solar modules comprising the sealant composite and an insulating glass unit comprising at least two glass panes and the edge seal.
ONE-COMPONENT TOUGHENED EPOXY ADHESIVES WITH IMPROVED HUMIDITY RESISTANCE
The present invention is a toughened one component epoxy adhesive composition demonstrating improved resistance to humidity. Wherein said one-part structural adhesive comprises: A) a blocked PU-polymer toughener compound; B) an epoxy resin component comprising a solid epoxy resin, a liquid epoxy resin, or mixture thereof; C) a curing agent; D) a urea compound; and E) optionally a filler, wherein the blocked PU-polymer toughener (A) is a reaction product of a reaction mixture comprising of: i) a polyether, ii) a hydroxyl-terminated polybutadiene, iii) a polyisocyanate, iv) a chain extender, and v) a capping group.
ONE-COMPONENT TOUGHENED EPOXY ADHESIVES WITH IMPROVED HUMIDITY RESISTANCE
The present invention is a toughened one component epoxy adhesive composition demonstrating improved resistance to humidity. Wherein said one-part structural adhesive comprises: A) a blocked PU-polymer toughener compound; B) an epoxy resin component comprising a solid epoxy resin, a liquid epoxy resin, or mixture thereof; C) a curing agent; D) a urea compound; and E) optionally a filler, wherein the blocked PU-polymer toughener (A) is a reaction product of a reaction mixture comprising of: i) a polyether, ii) a hydroxyl-terminated polybutadiene, iii) a polyisocyanate, iv) a chain extender, and v) a capping group.
ELECTRODE BINDER COMPOSITION, ELECTRODE COATING COMPOSITION, POWER STORAGE DEVICE ELECTRODE, AND POWER STORAGE DEVICE
Provided are an electrode binder composition that provides an electrode that exhibits high durability even when an active material that shows a large volume change is used, an electrode coating liquid composition containing the electrode binder composition, a power storage device electrode including an electrode mixture layer containing a solid of the electrode coating liquid composition, and a power storage device including the power storage device electrode. An electrode binder composition includes (A) a polyurethane, (B) a fibrous nanocarbon material having an average fiber length of 0.5 μm or more, and (C) water. The polyurethane is obtained by reacting together (a) a polyisocyanate, (b) a polyol, (c) a compound having one or more active hydrogen groups and a hydrophilic group, and (d) a chain extender. (b) contains an olefinic polyol having 1.5 or more active hydrogen groups and/or a carbonate diol having less than 6 carbon atoms between carbonate bond chains.
ELECTRODE BINDER COMPOSITION, ELECTRODE COATING COMPOSITION, POWER STORAGE DEVICE ELECTRODE, AND POWER STORAGE DEVICE
Provided are an electrode binder composition that provides an electrode that exhibits high durability even when an active material that shows a large volume change is used, an electrode coating liquid composition containing the electrode binder composition, a power storage device electrode including an electrode mixture layer containing a solid of the electrode coating liquid composition, and a power storage device including the power storage device electrode. An electrode binder composition includes (A) a polyurethane, (B) a fibrous nanocarbon material having an average fiber length of 0.5 μm or more, and (C) water. The polyurethane is obtained by reacting together (a) a polyisocyanate, (b) a polyol, (c) a compound having one or more active hydrogen groups and a hydrophilic group, and (d) a chain extender. (b) contains an olefinic polyol having 1.5 or more active hydrogen groups and/or a carbonate diol having less than 6 carbon atoms between carbonate bond chains.
TWO COMPONENT COATING COMPOSITIONS
Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.
High temperature epoxy adhesive formulations
The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.
High temperature epoxy adhesive formulations
The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.
CURABLE POLYFARNESENE-BASED COMPOSITIONS
A polymer having a hydrophobic polymer chain derived from monomers of farnesene and other optional monomers, such as dienes and vinyl aromatics. The polymer also includes one or more terminal functional groups, such as an amino group, a glycidyl group, a carboxylic acid group, a (meth)acrylate group, a silane group, an isocyanate group, an acetoacetate group, a phenolic group, and a hydroxyl group. Functional groups, such as carboxylic acids, may also be grafted along the hydrophobic polymer chain. The polymer may be incorporated in curable compositions that optionally include one or more polymer resins having similar functional groups. Methods for preparing the curable polymer compositions are also provided. The curable or cured form of the polymer composition may be used in various products, such as a sealant, a coating, a caulk, an electric potting compound, a membrane, a sponge, a foam, an adhesive, or a propellant binder.
CURABLE POLYFARNESENE-BASED COMPOSITIONS
A polymer having a hydrophobic polymer chain derived from monomers of farnesene and other optional monomers, such as dienes and vinyl aromatics. The polymer also includes one or more terminal functional groups, such as an amino group, a glycidyl group, a carboxylic acid group, a (meth)acrylate group, a silane group, an isocyanate group, an acetoacetate group, a phenolic group, and a hydroxyl group. Functional groups, such as carboxylic acids, may also be grafted along the hydrophobic polymer chain. The polymer may be incorporated in curable compositions that optionally include one or more polymer resins having similar functional groups. Methods for preparing the curable polymer compositions are also provided. The curable or cured form of the polymer composition may be used in various products, such as a sealant, a coating, a caulk, an electric potting compound, a membrane, a sponge, a foam, an adhesive, or a propellant binder.