The present application provides a conductive paste and an electronic device, and relates to the technical field of function materials. The conductive paste according to the present application includes: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent. The base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin. According to the technical solution of the present application, soldering can be performed directly by solder paste, and good flexibility is brought.

The present application provides a conductive paste and an electronic device, and relates to the technical field of function materials. The conductive paste according to the present application includes: a base resin, a solvent, a conductive filler, a curing agent, and an auxiliary agent. The base resin is a mixture of epoxy resin and polyurethane, a weight percentage of the epoxy resin in the base resin is greater than or equal to 50%, and the epoxy resin limits the polyurethane in a structure formed by curing of the base resin. According to the technical solution of the present application, soldering can be performed directly by solder paste, and good flexibility is brought.

The present invention provides a blocked isocyanate composition comprising a blocked isocyanate compound in which an isocyanate group of an isocyanate compound is blocked with a fluoroalcohol compound, and at least one amidate compound represented by the following Formula (2):

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wherein B, G, J, R.sup.7. and R.sup.8 are as defined in the specification.

The present application provides a sublimation ink which is capable of being transferred to natural fiber fabrics, such as cotton and linen, in addition to synthetic fabrics, such as polyester, nylon, etc., and shows significantly improved color fastness. The sublimation ink may include a resin containing at least one active hydrogen, a crosslinking agent having at least two isocyanate (—NCO) groups, and one or more colorants. The sublimation ink may also include one or more carriers, binders, thickeners, and/or solvents. An image can be printed on a transfer medium (e.g. paper) at room temperature with the sublimation ink using conventional offset printer so that the sublimation ink remains inactive. The image can be subsequently transferred onto any desired fabrics under heat and pressure, in which the sublimation ink is activated and bonds the colorant to the fabrics with excellent color effect.

The present application provides a sublimation ink which is capable of being transferred to natural fiber fabrics, such as cotton and linen, in addition to synthetic fabrics, such as polyester, nylon, etc., and shows significantly improved color fastness. The sublimation ink may include a resin containing at least one active hydrogen, a crosslinking agent having at least two isocyanate (—NCO) groups, and one or more colorants. The sublimation ink may also include one or more carriers, binders, thickeners, and/or solvents. An image can be printed on a transfer medium (e.g. paper) at room temperature with the sublimation ink using conventional offset printer so that the sublimation ink remains inactive. The image can be subsequently transferred onto any desired fabrics under heat and pressure, in which the sublimation ink is activated and bonds the colorant to the fabrics with excellent color effect.

A curable precursor composition for a fluoroelastomers, methods of making fluoroelastomers, shaped articles and methods of making shaped articles.

An anti-staining fabric includes a base cloth and an anti-staining resin. The anti-staining resin is disposed on the base cloth, in which a method of fabricating the anti-staining resin includes the following steps. A first thermal process is performed to mix a polyol, a cross-linking agent, and a choline to form a first mixture, in which a reaction temperature of the first thermal process is between 90° C. and 120° C. A second thermal process is performed to mix the first mixture and a chain extender to form the anti-staining resin, in which the chain extender includes a first reagent and a second reagent, and a reaction temperature of the second thermal process is between 120° C. and 150° C.

A pressure-sensitive adhesive composition is provided. The pressure-sensitive adhesive composition shows stable antistatic performance, and in particular, stably maintains its antistatic performance even when the pressure-sensitive adhesive composition is kept for an extended time under extreme conditions or conditions in which environmental changes are severe, and also has excellent general physical properties such as pressure-sensitive adhesive properties, durability and workability.

The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one latex; (C) at least one compound selected from the group consisting of polyacrylates, lignin derivatives and mixtures hereof; and (D) possibly at least one additive; the dipping bath composition being essentially free of epoxides, and the dipping bath composition being essentially free of resorcinol, formaldehyde and the reaction products thereof. ##STR00001##

The invention relates to polymers containing silane groups, to a method for their production and to their use as a component of curable compositions, in particular of moisture-curing sealants, adhesives or coatings that can be applied at ambient temperature, or of hot-melt adhesives containing silane groups. The polymers containing silane groups are obtained in particular by means of a special hydroxysilane which can be produced in particular from the reaction of lactides with aminosilanes.