Patent classifications
C08G59/063
Methods for preparing coating compositions for protecting oilfield operational components
Coating compositions for coating an oilfield operational component, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of the oilfield operational component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.
THERMOSETTABLE PRECURSOR OF A STRUCTURAL ADHESIVE COMPOSITION WITH CORROSION RESISTANCE
A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, a method of bonding two parts and to uses of the thermosettable precursor of an expanded structural adhesive composition.
EPOXY RESIN, RESIN COMPOSITION, RESIN SHEET, RESIN CURED PRODUCT, RESIN SUBSTRATE AND MULTILAYER SUBSTRATE
An epoxy resin having end groups each having an epoxy group that are disposed at both ends respectively, and between the end groups, either or both of a first structure in which an aromatic cyclic group, an ether oxygen, a methylene group, an aromatic cyclic group, a methylene group, an ether oxygen and an aromatic cyclic group are bonded together in this order and a second structure in which an aromatic cyclic group, a methylene group, an ether oxygen, an aromatic cyclic group, an ether oxygen, a methylene group and an aromatic cyclic group are bonded together in this order.
EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND
An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:
E1-(M1).sub.a1-(L1).sub.b1-(M2).sub.a2-L2-A1-L3-(M3).sub.a3-(L4).sub.b2-(M4).sub.a4-E2 Formula 1
E3-(A2).sub.c1-(L5).sub.b3-(M5).sub.a5-L6-(M6).sub.a6-L7-(M7).sub.a7-(L8).sub.b4-(A3).sub.c2-E4 Formula 2
In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.
Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of η′2/η′1 equal to 3 or less, wherein η′1 is an initial dynamic shear viscosity (Pa.Math.s) and η′2 is a maximum value of dynamic shear viscosity (Pa.Math.s), in a measurement of dynamic shear viscosity.
NAPHTHOL RESIN, EPOXY RESIN, EPOXY RESIN COMPOSITION, AND CURED PRODUCTS THEREOF
There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula:
##STR00001##
where R.sup.1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.
Crosslinking Compositions and Coatings Formed Therefrom
A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I):
##STR00001##
X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.
Coated oilfield operational components and methods for protecting and extending the service life of oilfield operational components
Coating compositions for coating an oilfield operational component, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of the oilfield operational component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.
DIMERS FROM BIOREACHABLE MOLECULES AS COPOLYMERS
The present disclosure relates to compositions derived from bioreachable molecules, such as amino acids or hydroxy acids. In particular, the composition can be a monomer, a polymer, or a copolymer derived from an amino acid dimer or a hydroxy acid dimer.
RECYCLABLE AND REWORKABLE EPOXY RESINS
An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.