The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000,000, a method of preparing the same, a composition comprising the same, and a use thereof. The epoxy resin having controlled distribution of molecular weight of the present disclosure may have improved thermal properties of an epoxy system by expanding the distribution of molecular weight, and may exhibit excellent processability.

An epoxy resin, which is obtained by reacting at least a compound having one or more epoxy groups and a compound having a functional group that reacts with the epoxy groups, satisfies conditions (I) and/or (II): (I) the compound having a functional group that reacts with the epoxy groups includes a trihydric or higher phenol compound and/or a compound including a trifunctional or higher polyisocyanate; (II) the epoxy resin has an average degree of polyfunctionalization (X1) per molecule, as expressed by Formula (1), of 0.30 or more:

Average degree of polyfunctionalization (X1)=number of ends per molecule of epoxy resin−2.  Formula (1):

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

An advanced epoxy resin including a reaction product of (A) at least one epoxy resin; (B) at least one cashew nutshell liquid; and (C) at least one multifunctional carboxylic acid; a curable epoxy resin composition prepared using the above advanced epoxy resin; and the use of the above curable epoxy resin composition to prepare a coating.

The present invention provides a curable composition comprising a urethane-modified epoxy resin (A) as an essential component of a main material, and an acid anhydride (B) as an essential component of a curing agent, wherein the urethane-modified epoxy resin (A) is a reaction product of a polyisocyanate compound (a1), a polyester polyol (a2), and a hydroxyl group-containing epoxy resin (a3) as essential reaction raw materials. The curable composition of the invention is advantageous in that a cured product having excellent fracture toughness and excellent tensile strength can be formed from the composition.

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

A resin composition of the present invention is a resin composition used for forming a stress relaxation layer (102) of a metal base copper-clad laminate (100) configured by laminating a metal plate (101), the stress relaxation layer (102), and a piece of copper foil (103) in this order, the resin composition including: an epoxy resin having a polyether structure; a phenoxy resin; and a heat dissipation filler, in which the resin composition satisfies a characteristic of a storage elastic modulus at 25° C. being equal to or more than 0.01 GPa and equal to or less than 1.6 GPa.

An epoxy functionalized surfactant composition including a reaction product of: (a) a hydrophilic material and (b) an epoxy resin hydrophobe material having an average molecular weight of greater than about 370 Daltons; the above epoxy functionalized surfactant composition being used to prepare a waterborne epoxy dispersion composition including (A) the above epoxy functionalized surfactant composition, (B) an epoxy resin, and (C) water; and processes for preparing the epoxy functionalized surfactant composition and the above waterborne epoxy dispersion composition.

Provided are aqueous resin solutions having unique rheologies and products incorporating the same. The water-based materials provided herein are thermo-thickening, and the materials increase dramatically in viscosity (at least 100 times) in a desired temperature range increase (20 C to <100 C) at ambient pressure. Suitable resins comprising a hydrophobic group and a hydrophilic group may be selected from an epoxy resin, a phenol-formaldehyde resin, a polyurethane resin, an acrylic resin, a polyester resin, an acrylic-urethane resin, a melamine resin, a melamine-formaldehyde resin, an amino resin, and combinations thereof. A specific epoxy functional resin/polymer suitable for the resin solutions are prepared by reacting (A) an epoxy pre-polymer of (1) one or more polyols and (2) one or more epoxy functional materials with (B) a di- or polyamine, thereby forming the aqueous thermo-thickening resin solution. The resin solutions are substantially free of cross-linking agents.