The invention provides an epoxy compound A represented by the following formula (1): ##STR00001## in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R.sub.1 and R.sub.2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R.sub.3 to R.sub.8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R.sub.3 to R.sub.8 is a glycidyl ether group or a 2-methylglycidyl ether group; R.sub.9 to R.sub.12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p.sub.1, p.sub.2, and q are average values of repetition, m is 0.5 to 10, p.sub.1 and p.sub.2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

This application relates, in part, to novel salts represented by the following structure of Formula (1):

##STR00001##

wherein R.sup.1a is selected from the group consisting of hydrogen and optionally substituted alkyl (e.g., unsubstituted C.sub.1-6 alkyl, e.g., —CH.sub.3); R.sup.1b is optionally substituted alkyl (e.g., unsubstituted C.sub.1-6 alkyl, e.g., —CH.sub.3); each occurrence of R.sup.2 and R.sup.3 is independently selected from the group consisting of hydrogen, optionally substituted alkyl, optionally substituted cycloalkyl, and optionally substituted aryl; R.sup.2 and R.sup.3 can combine with each other to form optionally substituted cycloalkyl; each m and n is independently an integer ranging from 1 to 20 (e.g., m and n is independently an integer ranging from 1 to 5); and each of Q.sup.1⊖ and Q.sup.2⊖ is independently a counterion (e.g., each of Q.sup.1⊖ and Q.sup.2⊖ is independently a counterion selected from the group consisting of chloride, bromide, fluoride, iodide, acetate, carboxylate, hydrogen sulfate, nitrate, and phenolate, and sulfonate, e.g., chloride), and methods of making the same.

An epoxy resin emulsion includes a continuous phase including an aqueous carrier and an acid. The emulsion also includes a dispersed phase including an epoxy resin. The epoxy resin is the reaction product of an amine compound and a first epoxy reactant. The first epoxy reactant itself includes the reaction product of (1) an aromatic diol monomer, (2) a di-glycidyl ether of Bisphenol A and/or a di-glycidyl ether of catechol, and (3) a C8-C18 alkyl phenolic end-capping agent. The (1) aromatic diol monomer has the structure: ##STR00001##
In this structure, each of R.sup.1-R.sup.4 is independently a hydrogen atom, a C.sub.1-C.sub.8 alkyl group, a C.sub.3-C.sub.8 cycloalkyl group, an aryl group, an aralkyl group, a halide group, a cyano group, a nitro group, a blocked isocyanate group, or a C.sub.1-C.sub.8 alkyloxy group or wherein any two or more of R.sup.1-R.sup.4 may be a fused ring.

An aliphatic epoxy-terminated polysulfide polymer has the formula R″—CHOH—CH2-S—R—(Sy-R)t-S—CH2-CHOH—R″ and is formed by a process, where each R is independently chosen from branched alkanediyl or branched arenediyl groups and groups with the structure —(CH2)a-O—(CH2)b-O—(CH2)c- and about 0 to about 20% of the number of R-groups are branched alkanediyl or branched arenediyl groups and about 80 to about 100% of the number of R-groups have the structure —(CH2)a-O—(CH2)b-O—(CH2)c-, where t is from about 1 to about 60, y is an average value of from about 1.0 to about 2.5, b is an integer value of from about 1 to about 8, and a and c are independently integers from about 1 to about 10, and where each R″ is independently a particular radical where, m, n, o, p, q and r independently have a value of from about 1 to about 10.

The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.

A curable composition comprises: 1 to 65 percent by weight of polyepoxide comprising an addition reaction product of phenolphthalein and bisphenol A diglycidyl ether; 5 to 50 percent by weight of liquid polyepoxide; and an effective amount of curative for curing the curable composition. A curable adhesive film comprising the curable composition, and method of bonding are also disclosed.

This invention provides methods for coating food and beverage containers using polymers which are preferably polyether polymers. The invention further provides liquid and powder coating compositions including such polymers and which have utility in a variety of other coating end uses, including, for example, valve and pipe coatings.

An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of ##STR00001##
wherein X is —O—, ##STR00002##
and each R.sup.1 is independently CH.sub.3, CH.sub.2F, CHF.sub.2, or CF.sub.3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: ##STR00001##
where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.

An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.