Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. ##STR00001##
In the formula, R.sup.1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R.sup.2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R.sup.2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

The present disclosure relates to a modified epoxy resin having the formula (I): ##STR00001## wherein R is R.sub.1, R.sub.2 or a combination of R.sub.1 and R.sub.2; R.sub.1 and R.sub.2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, C(O)O, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.

The present disclosure relates to a modified epoxy resin having the formula (I): ##STR00001## wherein R is R.sub.1, R.sub.2 or a combination of R.sub.1 and R.sub.2; R.sub.1 and R.sub.2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, C(O)O, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.

In an embodiment, a fiber reinforced composite can comprise a dynamically crosslinked polymer network comprising a polyester matrix and a plurality of crosslinks; a transesterification catalyst; and a fabric layer. A method of making the composite can comprise coating the fabric layer with a composition comprising a pre-crosslinked polymer composition to form a coated fabric; and melt impregnating the coated fabric with the pre-crosslinked polymer composition to form a pre-impregnated composite; and curing the pre-crosslinked polymer composition to form the dynamically crosslinked polymer network.

In an embodiment, a fiber reinforced composite can comprise a dynamically crosslinked polymer network comprising a polyester matrix and a plurality of crosslinks; a transesterification catalyst; and a fabric layer. A method of making the composite can comprise coating the fabric layer with a composition comprising a pre-crosslinked polymer composition to form a coated fabric; and melt impregnating the coated fabric with the pre-crosslinked polymer composition to form a pre-impregnated composite; and curing the pre-crosslinked polymer composition to form the dynamically crosslinked polymer network.

The present invention provides systems, methods and devices for sealing and/or curing a leakage at a remote site in a pipe, the system including a multiplicity of polymeric carrier plugs of a deformable material including pores, at least one sealant composition disposed in the pores; and a carrier liquid composition adapted to transport the multiplicity of polymeric carrier plugs to a site of the leakage, wherein at least some of the multiplicity of polymeric carrier plugs polymeric carrier plugs are adapted to transport the at least one sealant composition from a first site in the carrier liquid composition to a remote site and to seal the leakage at the remote site.

The present invention provides systems, methods and devices for sealing and/or curing a leakage at a remote site in a pipe, the system including a multiplicity of polymeric carrier plugs of a deformable material including pores, at least one sealant composition disposed in the pores; and a carrier liquid composition adapted to transport the multiplicity of polymeric carrier plugs to a site of the leakage, wherein at least some of the multiplicity of polymeric carrier plugs polymeric carrier plugs are adapted to transport the at least one sealant composition from a first site in the carrier liquid composition to a remote site and to seal the leakage at the remote site.

A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.

A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.

Corrosion-inhibiting microgels that are suitable for use in non-chromated primer compositions. Each discrete microgel is composed of a cross-linked polymer network and organic corrosion-inhibiting compounds entrapped or immobilized within the polymer network.