[Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 m or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.

The present invention relates to brominated polyether polyols, processes for the production as well as intermediates useful in the production of the same and to processes for the preparation of flame-retardant blends, premixes as well as polyurethane foams.

Compositions useful as plastic additives may be prepared from renewable resources such as vegetable oils by functionalizing an unsaturated fatty acid ester with epoxy, acyloxy, and optionally alkoxy groups.

The present invention relates to methods for inactivating a lipid-enveloped virus using environmentally compatible detergents, and to methods for preparing a biopharmaceutical drug using environmentally compatible detergents. The invention also provides environmentally compatible detergents.

The present invention is a composition for forming an organic film, containing: (A) a material for forming an organic film; (B) a polymer having a repeating unit represented by the following general formula (1); and (C) a solvent, where W.sub.1 represents a saturated or unsaturated divalent organic group having 2 to 50 carbon atoms and having one or more fluorine-containing structures represented by the following formulae (2), and W.sub.2 represents a saturated or unsaturated divalent organic group having 2 to 50 carbon atoms. This can provide: a composition for forming an organic film which is excellent in film-formability on a substrate and filling property, suppresses humps in an EBR process, and has an excellent process margin when used for an organic film for a multilayer resist process; a method for forming an organic film, using the composition; a patterning process; and a polymer to be contained in the composition for forming an organic film.

##STR00001##

There are used a compound which, while being a curable resin, can easily exhibit easy dismantlability, repairability, and remoldability when being in the form of a cured product; a curable resin composition obtained using the same; and a cured product thereof. A glycidyl ether group-containing compound represented by the following formula is used. In the formula, the furan-derived structure may include a substituent, n represents an average value of repetition number of 0.5 to 10, m is an integer of 1 to 4, Z.sup.1 is a structure having a glycidyl ether group, Z.sup.2 is a specific flexible structure containing an alkylene chain, an alkylene ether chain, or the like, and Z.sup.3 is a divalent linking group, and the multiple structures present in one molecule may be identical or different from each other

##STR00001##

There is provided a compound which, while being a curable resin, can easily exhibit repairability, easy disassembly, and remoldability when being in the form of a cured product, a curable resin composition obtained using the same; and a cured product thereof. Specifically, there is provided a phenolic hydroxyl group-containing compound in which a structural unit A having one or more phenolic hydroxyl groups and a structural unit B different from the A are linked in A-B-A, and the structural unit A and the structural unit B are bonded by a reversible bond by a Diels-Alder reaction between a furan structure and a maleimide structure.