[Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 m or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.

There are used a compound which, while being a curable resin, can easily exhibit easy dismantlability, repairability, and remoldability when being in the form of a cured product; a curable resin composition obtained using the same; and a cured product thereof. A glycidyl ether group-containing compound represented by the following formula is used. In the formula, the furan-derived structure may include a substituent, n represents an average value of repetition number of 0.5 to 10, m is an integer of 1 to 4, Z.sup.1 is a structure having a glycidyl ether group, Z.sup.2 is a specific flexible structure containing an alkylene chain, an alkylene ether chain, or the like, and Z.sup.3 is a divalent linking group, and the multiple structures present in one molecule may be identical or different from each other

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